Issues in chip-package codesign with MCM-D/flip-chip technology

Proceedings - 1998 IEEE Symposium on IC/Package Design Integration, IPDI 1998

Volumn 1998-February, Issue , 1998, Pages 88-92

  Franzon, Paul ^a   Schaffer, Toby ^a   Lipa, Steve ^a   Glaser, Alan ^a  

^a North Carolina State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CLOCKS;

CASE-STUDIES; CLOCK DISTRIBUTION; IN-CHIP; LESS NOISY; ON CHIPS; PRACTICAL ISSUES; PROCESS VARIATION;

INTEGRATED CIRCUITS;

EID: 84979169496     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IPDI.1998.663634     Document Type: Conference Paper

References (4)

1. Daryl Ann Doane and Paul D. Franzon, editors. Multichip Module Technologies and Alternatives: The Basics. Van Nostrand Reinhold, New York, 1993.
2. B. Gieseke et al. A 600MHz Superscalar RISC Microprocessor with Out-of-Order Execution. In ISSCC Digest of Technical Papers, pages 176{177, February 1997.
3. Toby Schaffer, Alan Glaser, Srisai Rao, and Paul Franzon. A Flip-Chip Implementation of the Data Encryption Standard (DES). In 1997 IEEE Multi-Chip Module Conference Proceedings, February 1997.
4. Qing Zhu and Wayne Dai. Chip and Package Co-Design Technique for Clock Networks. In 1996 IEEE Multi-Chip Module Conference Proceedings, February 1996.