Packaging of large area power chips - Extending the limits of standard module technology

2006 4th International Conference on Integrated Power Systems, CIPS 2006

Volumn , Issue , 2006, Pages

  Scheuermann, U ^a   Ebersberger, F ^a  

^a Semikron Elektronik GmbH AndCo KG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH VOLUMES; INSULATING SUBSTRATES; POWER DENSITIES; POWER MODULE; RELIABILITY REQUIREMENTS; STANDARD MODULE; STANDARD TECHNOLOGY; STATE-OF-THE-ART TECHNOLOGY;

CHIP SCALE PACKAGES;

EID: 84971440109     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Annacker, R.; Grasshoff, T.: SEMiX - A New Platform for IGBT Modules, PCIM Europe 08/2003, pp 46-47
2. Stockmeier, T.; Manz, Y; Steger, J.: Novel High Power Semiconductor Module for Trench IGBTs, Proc. ISPSD 2004, Japan, pp 343-346.
3. Hamidi, A. : Contribution a l'etude des phenomt:mes de fatigue thermique des modules IGBT de forte puissance destines aux application de traction. Dissertation, Grenoble, 1998
4. Scheuermann, U.; Herr, E.: A Novel Power Module Design and Technology for Improved Power Cycling Capability, Microelectronics Reliability 41/9-10 (2001), pp 17l3-1718.
5. Mertens, C.; Sittig, R.: Low Temperature Joining Technique for Improved Reliability, Proc. 2nd International Conference on Integrated Power Systems CIPS 2002, pp 95-100.