Study on controlling the adsorption state of particle on the polished silicon wafer

2001 6th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2001 - Proceedings

Volumn 1, Issue , 2001, Pages 464-467

  Zhang, Kailiang ^a   Liu, Yuling ^a   Wang, Fang ^a   Si, Tianhua ^a  

^a HEBEI UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

adsorption state; polished wafer; preferential adsorption model; surfactant

Indexed keywords

EID: 84966642026     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSICT.2001.981518     Document Type: Conference Paper

References (4)

1. T. Hattori, V. J. Ruzyllo, R. Novak; Wafer cleaning, J. Electrochem. Soc., 1998,97(35): 1
2. Diane Hymes, Igor Malik, Brush scrubbing emerges as future wafer-cleaning technology. Solid State Technology, 1997(7): 209-214
3. Haiyun Gu, A study of the mechanism and removal techniques of the particle contamination on Si wafer in ULSI. A dissertation of Hebei University of Technology for master degree, TianJin, 2001
4. Yuling Liu, Na Liu, Yang Cao, Investigation on adsorption state of surface adsorbate on silicon wafer, Rare Matal, 1999,18(2): 106-112