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Volumn , Issue , 2000, Pages 183-187
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Novel high dielectric constant nano-structure polymer-ceramic composite for embedded capacitor application
a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
CERAMIC MATERIALS;
ELECTRIC PROPERTIES;
ELECTRONICS PACKAGING;
MICROELECTRONICS;
MICROSTRUCTURE;
MULTICHIP MODULES;
NANOSTRUCTURED MATERIALS;
PERMITTIVITY;
POLYMERS;
PRINTED CIRCUIT BOARDS;
RELIABILITY;
EMBEDDED CAPACITOR TECHNOLOGY;
NANOSTRUCTURE POLYMER CERAMIC COMPOSITE;
PRINT WIRE BOARD;
SYSTEM ON PACKAGING;
CAPACITORS;
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EID: 0034476306
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (29)
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References (17)
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