Mixed assembly on PCB using a novel flip-chip technology

Advancing Microelectronics

Volumn 27, Issue 5, 2000, Pages 28-30

  Vanfleteren, J ^a   Stoukatch, S ^a   Vandecasteele, B ^a   Van Calster, A ^a   Criel, S ^b   Willems, G ^b   De Langhe, P ^b   Vandam, L ^b   Allaert, K ^b  

^a IMEC   (Belgium)

^b LUCENT TECHNOLOGIES   (United States)

Author keywords

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Indexed keywords

EID: 77950064111     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. th European Microelectronics Conference - 1997, pp. 618-623;
2. also in Journal of Electronics Manufacturing 7: (4) pp. 287-292, dec.97.
3. C.P. Wong, S.H. Shi, G.Jefferson: "High-Per-formance No-Flow Underfills for Low-Cost Flip-Chip Applications: Material Characterisation," IEEE Trans. On CPMT - Part A, Vol.21, No. 3, Sept. '98, pp. 450-458.
4. J. Vanfleteren et al. "A reliable and cost-effective flip-chip assembly process using a combination of isotropically conductive and non-conductive adhesives," to be published in IEEE Trans. on CPMT.
5. S. Zhang, J. De Baets, and A. Van Calster, "A two-layer high density printed circuit board and its reliability," Microelectronics Reliability, no. 39, 1999, pp. 1337-1341.