Adhesive flip chip bonding on flexible substrates

Journal of Electronics Manufacturing

Volumn 7, Issue 4, 1997, Pages 245-252

  Aschenbrenner, R ^a   Miessner R ^b   Reichl, H ^a  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000963388     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0960313197000257     Document Type: Article

References (22)

1. P. Placke, "The flipflex-technology for contactless smart cards and combi cards", Workshop on Smart Card Technologies and Applications, Berlin (1996).
2. D. Finn, "Coil and interconnection technology for contactless cards", Workshop on Smart Card Technologies and Applications, Berlin (1996).
3. F. Juskey and R. Carson, "DCA on flex: A low cost/stress approach", Proc. Advances in Electronic Packaging 1997, Kohala Coast, Hawaii (1997), pp. 313-317.
4. S. Arndt, R. Bergeron, J. Dery, K. Knadle and H. Wilson, "Flip chip for flex applications", SMIProceeding, San Jose (1996), pp. 353-358.
5. K. Adachi, "Packaging technology for liquid crystal displays", Solid State Technology (1993), pp. 63-71.
6. A. Cowburn, M. Warren, C. Savage, H. Schofield, K. Netting and K. Medlock, "Flex circuit requirements for flipchip attach", International Flip Chip, BGA, TAB and AP Symposium, Sunnyvale, California (1996), pp. 75-136.
7. J. Liu, "Polymeric electronic packaging worldwide achievements and future challenges", Proc. Adhesives in Electronics, VDI/VDE-Conf., Berlin (1994).
8. M. Zwolinski et al., "Electrically conductive adhesives for surface mount solder replacement", SMI Proceeding, San Jose (1996), pp. 391-401.
9. J. Guy, "Dealing with the issues of lead solder replacement", Nepcon West Proceeding, Anaheim (1995), pp. 1066-1076.
10. R. Pernice, J. Hannafin and R. Estes, "Evaluation of isotropic conductive adhesive for solder replacement", ISHM Proceeding, Boston (1994), pp. 561-569.
11. G. Habenicht, Kleben (Springer Verlag Berlin, Heidelberg, 1990).
12. R. Estes, "Polymer flip chip a technology assessment of solderless bump processes and reliability", Proc. Adhesives in Electronics, VDI/VDE-Conference, Berlin (1994).
13. K. Gilleo, "Adhesives/expoxies and dispensing", SMT Magazine (1996), pp. 56-60.
14. R. Aschenbrenner, E. Zakel, G. Azdasht, A. Kloeser and H. Reichl, "Fluxless flip chip bonding on flexible substrates: A comparison between adhesive bonding and soldering", Proc. Surface Mount International (1995), pp. 91-101.
15. H. M. van Noort, M. J. H. Kloos and H. E. A. Schäfer, "Anisotropic conductive adhesive for chip on glass and other flip chip applications," J. Electron. Manuf. 5(1) (1995), 27-31.
16. R. Aschenbrenner, J. Gwiasda, J. Eidring, E. Zakel and H. Reichl, "Flip chip attachment using nonconductive adhesives and gold ball bumps", Proc. IEPS Atlanta (1994), pp. 794-807.
17. W. Turner and G. Lin, "Flat panel display packaging," Proc. ECTC, Las Vegas, Nevada (1995), pp. 177-181.
18. E. Zakel and H. Reichl, "Flip chip assembly using gold, gold-tin, and nickel-gold metallurgy", in Flip Chip Technology, ed. John Lau (McGraw-Hill, 1996), pp. 415-490.
19. A. Ostmann, J. Kloeser and H. Reichl, "Implementation of a chemical wafer bumping process", Proc. International Electronics Packaging Conference, San Diego, CA (1995), pp. 354-366.
20. R. Aschenbrenner, A. Ostmann, G. Motulla, K. Becker, E. Zakel and H. Reichl, "Flip chip interconnection to glass substrates using anisotropic adhesives and electroless nickel bumps", Proc. Adhesives in Electronics '96, Stockholm, Sweden (1996).
21. J. Eldring, E. Zakel and H. Reichl, "Flip chip attach of silicon and GaAs fine pitch devices as well as inner lead TAB attach using ball bump technology", Proc. IEPS, San Diego (1993), pp. 304-320.
22. J. Kloeser, K. Kutzner, K. Gross, R. Aschenbrenner and H. Reichl. "A new production line for low cost flip chip assembly", Proc. Surface Mount International, San Jose, California (1997).