Fabrication of micromachined devices on flexible substrates

2001 IEEE Emerging Technologies Symposium on BroadBand Communications for the Internet Era, ETS 2001 - Symposium Digest

Volumn , Issue , 2001, Pages 79-83

  Yaradanakul, A ^a   Yildiz, A ^a   Butler, D P ^a   Celik Butler Z ^a  

^a Southern Methodist University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOLOMETERS; FABRICATION; FLEXIBLE ELECTRONICS; INTERNET; POLYIMIDES; SILICON WAFERS; TEMPERATURE; TEMPERATURE SENSORS;

FABRICATION METHOD; FLEXIBLE POLYIMIDE SUBSTRATE; LOW-TEMPERATURE FABRICATION; MICROMACHINED DEVICES; POLYIMIDE SUBSTRATE; TECHNICAL CHALLENGES; TEMPERATURE COEFFICIENT OF RESISTANCE; TEMPERATURE FLUCTUATION;

SUBSTRATES;

EID: 84963856702     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ETS.2001.979427     Document Type: Conference Paper

References (13)

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