Effects of wafer emissivity on rapid thermal processing temperature measurement

10th IEEE International Conference on Advanced Thermal Processing of Semiconductors, RTP 2002

Volumn , Issue , 2002, Pages 59-67

  Chen, D H ^a   DeWitt, D P ^a   Tsai, B K ^a   Kreider, K G ^a   Kimes, W A ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMAGNETIC WAVE EMISSION; HEAT TREATMENT; PROCESSING; RAPID THERMAL PROCESSING; TEMPERATURE MEASUREMENT; THERMOCOUPLES; UNCERTAINTY ANALYSIS;

COMPARISON OF MODELS; GEOMETRICAL FEATURES; RADIATION THERMOMETERS; RADIATIVE PROPERTIES; THIN FILM THERMOCOUPLE; UNCERTAINTY ESTIMATES; WAFER EMISSIVITY; WAFER TEMPERATURE;

SILICON WAFERS;

EID: 84962362289     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RTP.2002.1039440     Document Type: Conference Paper

References (16)

1. Mattson, B., Timans, P.J., Tay, S.P., Devine, D.J., and Kim, J., 2001, "The Future of RTP, A Technology That Can Change The IC FAB Industry," the 7th Int. Conference on Advanced Thermal Processing of Semiconductors, pp13-27.
2. Timans, P.J., Sharangpani, R., and Thakur,R.P.S., 2000, "Rapid Thermal Processing," Handbook of Semiconductor Manufacturing Technology, Y. Nishi, and R. Doering, Eds., Marcel Dekker, Inc., New York, pp. 201-286.
3. Degertekin, F.L., Pei, J., Khuri-Yakub, B.T., and Saraswat, K.C., 1994, "In Situ Acoustic Temperature Tomography of Semiconductor Wafers," Applied Physics Letters, Vol. 64, pp. 1338-1340.
4. Burckel, D., Zaidi, S.H., and Brueck, S.R.J., 1995, "Sub-Feature Speckle Interferometry: A New Approach to Temperature Measurement," Mat. Res. Soc. Symp. Proc., Vol. 387, pp. 25-130.
5. Schietinger, C., Adams, B., and Yarling, C., 1991, "Ripple Technique: A Novel Non-Contact Wafer Emissivity and Temperature Measurement Method for RTP," Mat. Res. Symp. Proc., Vol. 224, pp.23-31.
6. Tsai, B.K., and DeWitt, D.P., 1999, "ITS-90 Calibration for Radiometers Using Wire/Thin-Film Thermocouples in the NIST RTP Tool: Effective Emissivity Modeling," the 7th International Conference on Advanced Rapid Thermal Processing of Semiconductors, pp. 125-135.
7. Kreider, K.G., and Gillen, G., 1999, "Thin-film Calibration Wafer Materials for RTP Temperature Measurement," the 7th Int. Conference on Advanced Thermal Processing of Semiconductors, pp. 142-147.
8. Kreider, K.G., and DiMeo, F., 1998, "Platinum/Palladium Thin-Film Thermocouples for Temperature Measurements on Silicon Wafers," Sensor and Actuator, A 69, pp.46-52.
9. Kreider, K.G., Chen, D.H., DeWitt, D.P., Kimes, W.A., Meyer, C.W., and Tsai, B.K., 2002, "Wafer Emissivity Effects on Lightpipe Radiometry in RTP Tools," Presented at the 201st Electrochemical Society Meeting, May 12-17, Philadelphia, PA.
10. Meyer, C.W., Allen, D.W., DeWitt, D.P., Kreider, K.G., Lovas, F.L., and Tsai, B.K., 1999, "ITS-90 Calibration of Radiometers Using Wire/Thin-Film Thermocouples in the NIST RTP Tool: Experimental Procedures and Results," the 7th Int. Conference on Advanced Thermal Processing of Semiconductors, pp. 136-141.
11. Zhou, Y.H., Shen, Y.J., Zhang, Z.M., Tsai, B.K., and DeWitt, D.P., 2000, "Impact of Directional Properties on The Radiometric Temperature Measurement in Rapid Thermal Processing," the 8th International Conference on Advanced Thermal Processing of Semiconductors, pp. 94-103.
12. Acharya, N., and Timans, P.J., 1998, "The Effect of Chamber Components on Wafer Temperature Response in an RTP System," Mat. Res. Soc. Symp. Proc., Vol. 525, pp. 23-26.
13. Touloukian, Y.S., Powell, R. W., Ho, C.Y., and Klemens, P.G., 1970, Thermal Conductivity: Metallic Elements and Alloys, Thermophysical Properties of Matter, IFI/Plenum, New York, Vol. 1, p. 339.
14. Incropera, F.P., and DeWitt, D.P., 2002, Fundamentals of Heat and Mass Transfer, 5th ed., Wiley, New York.
15. Siegel, R., and Howell, J.R., 2001, Thermal Radiation Heat Transfer, 4rd edition, Taylor & Francis, Washington, DC.
16. ANSYS, Inc., 275 Technology Drive, Canonsburg, PA 15317. The identification within this paper of particular commercial products is provided only for complete description of the system used here. It implies neither recommendation or endorsement by NIST, nor that the identified products are necessarily the best available for the purpose.