Effect of chamber components on wafer temperature response in an RTP system

Materials Research Society Symposium - Proceedings

Volumn 525, Issue , 1998, Pages 21-26

  Acharya, N ^a   Timans, P J ^a  

^a AG Associates Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; HEAT TRANSFER; SEMICONDUCTOR DEVICE MODELS;

RAPID THERMAL PROCESSING (RTP);

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0031629497     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-525-21     Document Type: Conference Paper

References (6)