Adhesion studies of thin films on ultra low k

Proceedings of the IEEE 2002 International Interconnect Technology Conference, IITC 2002

Volumn , Issue , 2002, Pages 206-208

  Maitrejean S ^a   Fusalba, F ^b   Patz, M ^c   Jousseaume, V ^a   Mourier, T ^a  

^a CEA LETI   (France)

^b STMICROELECTRONICS   (France)

^c JSR CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHEMICAL MECHANICAL POLISHING; INTEGRATED CIRCUIT INTERCONNECTS; SURFACE TREATMENT;

ADHESION STUDIES; BLANKET WAFERS; DAMASCENE STRUCTURE; FOUR-POINT BENDING METHOD; LAYER INTERFACES; LOW ADHESION; ULK MATERIALS; ULTRA LOW K MATERIALS;

INTERFACES (MATERIALS);

EID: 84961744658     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2002.1014935     Document Type: Conference Paper

References (6)

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6. M. Rivoire and al., unpublished works