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Volumn 64, Issue , 2015, Pages 84-92

Controlled degradation of disulfide-based epoxy thermosets for extreme environments

Author keywords

Degradable polymer; Disulfide; Thermoset

Indexed keywords

PETROLEUM RESERVOIR ENGINEERING; PETROLEUM RESERVOIRS; THERMOSETS;

EID: 84961288027     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymer.2015.03.020     Document Type: Article
Times cited : (88)

References (45)
  • 17
    • 0002608182 scopus 로고
    • Epoxy molding compounds as encapsulation materials for microelectronic devices
    • Springer Berlin Heidelberg
    • N. Kinjo, M. Ogata, K. Nishi, A. Kaneda, and K. Dušek Epoxy molding compounds as encapsulation materials for microelectronic devices Speciality polymers/polymer physics vol. 88 1989 Springer Berlin Heidelberg 1 48
    • (1989) Speciality Polymers/polymer Physics , vol.88 , pp. 1-48
    • Kinjo, N.1    Ogata, M.2    Nishi, K.3    Kaneda, A.4    Dušek, K.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.