Thermo-mechanical and flexural behavior of WB-PBGA package using moiré interferometry

Advances in Electronic Materials and Packaging 2001

Volumn , Issue , 2001, Pages 421-427

  Joo, Jinwon ^a   Oh, Kihwan ^a   Cho, Seungmin ^b   Han, Bongtae ^b  

^a Chungbuk National University   (South Korea)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; ELECTRONICS PACKAGING; INTERFEROMETRY; MODIFIED ATMOSPHERE PACKAGING; PACKAGING MATERIALS; SHEAR STRAIN; THERMAL LOAD;

ELECTRONIC PACKAGING; FLEXURAL BEHAVIOR; LOCAL DEFORMATIONS; MECHANICAL BENDING; NONLINEAR BEHAVIOR; PLASTIC BALL GRID ARRAYS; THERMALLY INDUCED; THERMO-MECHANICAL;

PACKAGING;

EID: 84960338954     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2001.984021     Document Type: Conference Paper

References (13)

1. Darveaux, R. and Mawer, A, "Thermal and Power Cycle Limit of Plastic ball grid array (PBGA) assemblies," Proc. Surface Mount Int. Conf., San Jose, CA, 1995, pp. 315-326.
2. Skipor, A.F., Harren, S.V. and Botsis, J., "On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder," ASME. J. Eng. Mater. Technol., Vol. 118, No. 1(1996), pp. 1-11.
3. Corbin, J.S, "Finite Element Analysis for Solder Ball Connect (SBC) Structural design Optimization,"IBM J. Research Development, Vol. 37, No. 5 (1993), pp. 585-596.
4. Lee, T., Lee, J. and Jung, I., "Finite Element Analysis for Solder Ball Failures in Chip Scale Packages," Microelectronics and Reliability, Vol. 38, No. 12, (1998), pp.1941-1947.
5. Post, D., Han, B. and Ifju, P., High Sensitivity Moiré: Experiental Analysis for Mechanics and Materials, Springer-Verlag (New York, 1994).
6. Guo, Y., Lim, C.K., Chen, W.T. and Woychik, C.G., "Solder Ball Connect (SBC) Assemblies Under Thermal Loading: I. Deformation Measurement via Moiré Interferometry, and Its Interpretation,"IBM J. Research Development, Vol. 37, No. 5 (1993), pp. 635-648.
7. Han, B. and Guo, Y., "Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry," J. Electronic Packaging. Trans. ASME, Vol.117 (1995), pp.185-191.
8. Han, B., "Deformation Mechanism of Two Phase Solder Column Interconnections under Highly Accelerated Thermal Cycling Condition: An Experimental Study," J. Electronic Packaging, Tran. ASME, Vol. 119 (1997), pp. 189-196.
9. Han, B., "Recent Advancements of Moiré and Microscopic Moiré Interferometry for Thermal Deformation Analysis of Microelectrics Devices," Experimental Mechanics, Vol. 38, No. 4(1998), pp. 278-288.
10. th Electronic Components and Technology Conference, Seattle, WA, May, 1998, pp. 336-344.
11. Lecht, L. and Skipor, A., "Mechanical Cycling Fatigue of PBGA package interconnects," Proc. 31th Int Microelectron. Packag. Soc. Conf., San Diego, CA, Nov., 1998, pp. 802-807.
12. Stout, E.A., Sottos, N.R and Skipor, A.F., "Mechanical Characterization of Plastic Ball Grid Array Package Flexure Using Moiré Interferometry," IEEE Trans. on Advanced Packaging, Vol. 23, No. 4 (2000), pp. 637-645.
13. Cho, S. M., Cho, S. Y. and Han, B., "Real-time Observation of Thermal Deformations in Microelectronics Devices: A Practical Approach Using Moiré Interferometry," Experimental Techniques, 2001 (submitted for publication).