Mechanical cycling fatigue of PBGA package interconnects

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3582, Issue , 1998, Pages 802-807

  Leicht, Larry ^a   Skipor, Andrew ^a  

^a Advanced Manufacturing Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); CRACK PROPAGATION; FATIGUE OF MATERIALS; MICROELECTRONICS; MICROPROCESSOR CHIPS; MORPHOLOGY; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; THERMAL CYCLING;

CHIP SCALE PACKAGES (CSP); PLASTIC BALL GRID ARRAYS (PBGA);

ELECTRONICS PACKAGING;

EID: 0032315130     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)