Thermal conductivity of powder silica hollow spheres

Thermochimica Acta

Volumn 526, Issue 1-2, 2011, Pages 178-184

  Liao, Yuchao ^a,b   Wu, Xiaofeng ^a   Liu, Haidi ^a   Chen, Yunfa ^a  

^a INSTITUTE OF PROCESS ENGINEERING   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

Finite element analysis; Numerical analysis; Powder silica hollow spheres; Thermal conductivity

Indexed keywords

ANSYS SOFTWARE; CALCULATED VALUES; EXPERIMENTAL TEST; EXPERIMENTAL VALUES; FINITE ELEMENT SIMULATIONS; HEAT CONDUCTION MODELS; HEAT-INSULATING MATERIALS; HOLLOW SILICA SPHERES; HOLLOW SPHERE; HOLLOW STRUCTURE; PACKING DENSITY; THEORETICAL CALCULATIONS; THERMO-PHYSICAL PROPERTY;

FINITE ELEMENT METHOD; HEAT CONDUCTION; NUMERICAL METHODS; SILICA; SPHERES; THERMAL INSULATING MATERIALS; THERMODYNAMIC PROPERTIES;

THERMAL CONDUCTIVITY;

EID: 80455160107     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tca.2011.09.011     Document Type: Article

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