Failure analysis of plastic packaged optocoupler light emitting diodes

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 346-349

  Hwang, Nam ^a   Naidu, P S R ^a   Trigg, A ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRONICS PACKAGING; FAILURE ANALYSIS; OPTOELECTRONIC DEVICES; SCANNING ELECTRON MICROSCOPY; WAVEGUIDE COUPLERS;

BAND-GAP EMISSION; ENERGY DISPERSIVE X RAY MICROANALYSIS; FAILURE MECHANISM; FAILURE RATE; P-N JUNCTION; PHOTOEMISSION MICROSCOPY; REVERSE BIAS LEAKAGE CURRENT; REVERSE LEAKAGE;

LIGHT EMITTING DIODES;

EID: 84954052924     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271543     Document Type: Conference Paper

References (6)

1. EIA/JEDEC STANDARD, Test Method A110-B, "Highly-Accelerated Stress Temperature and Humidity Stress Test (HAST)," JESD22-A110-B, February 1999.
2. EIA/JEDEC STANDARD, Test Method A113-B, "Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing," JESD22-A113-B, March 1999.
3. Christian Boit, Photoemission Microscopy-Advanced/Theory of operation in Microelectronic Failure Analysis, ASM International (1999), pp. 213-232.
4. th International Symposium on Testing and Failure Analysis (ISTFA), Santa Clara, CA, Nov. 1999, pp. 457-464.
5. V. Bondarenko, K. Petters, R. Krause-Rehberg, J. Gebauer, H. S. Leipner, "Study of vacancy-type defects after Cu diffusion in GaAs," Physica B 308-310 [1-4] (2001), pp. 792-795.
6. S. M. Sze, Physics of Semiconductor Devices, 2nd ed. Wiley (New York, 1981), pp. 402-407.