Validation of models for air cooled plane fin heat sinks used in computer cooling

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 243-250

  Saini, Manish ^a   Webb, Ralph L ^a  

^a PENNSYLVANIA STATE UNIVERSITY   (United States)

Author keywords

Aluminum; Central processing unit; Cooling; Ducts; Fluid flow measurement; Heat sinks; Numerical models; Performance analysis; Predictive models; Thermal conductivity

Indexed keywords

ALUMINUM; COOLING; DUCTS; FINS (HEAT EXCHANGE); FLOW OF FLUIDS; HEAT SINKS; HEAT TRANSFER; LAMINAR FLOW; NUMERICAL MODELS; PROGRAM PROCESSORS; THERMAL CONDUCTIVITY;

DEVELOPING LAMINAR FLOWS; FLOW CONFIGURATIONS; HEAT TRANSFER DATA; PERFORMANCE ANALYSIS; PREDICTIVE MODELS; RECTANGULAR CHANNEL; SEMIEMPIRICAL MODELS; THERMAL PERFORMANCE;

PARALLEL FLOW;

EID: 84950155430     PISSN: 19363958     EISSN: None     Source Type: Journal    
DOI: 10.1109/ITHERM.2002.1012464     Document Type: Article

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