Can plasma be formed in catalyst pores? A modeling investigation

Applied Catalysis B: Environmental

Volumn 185, Issue , 2016, Pages 56-67

  Zhang, Yu Ru ^a,b   Van Laer, Koen ^b   Neyts, Erik C ^b   Bogaerts, Annemie ^b  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b UNIVERSITY OF ANTWERP   (Belgium)

Author keywords

Applied voltage; Fluid simulation; Microdischarge; Plasma catalysis; Pore size

Indexed keywords

ATMOSPHERIC PRESSURE; CATALYSIS; CATALYSTS; DIELECTRIC MATERIALS; ELECTRIC DISCHARGES; ELECTRIC EXCITATION; ELECTRIC FIELDS; ELECTRONS; IMPACT IONIZATION; IONIZATION; IONIZATION POTENTIAL; IONS; PLASMA APPLICATIONS; PORE SIZE;

APPLIED VOLTAGES; DIELECTRIC BARRIER DISCHARGES; ELECTRON AND ION DENSITIES; ELECTRON IMPACT-IONIZATION; FLUID SIMULATIONS; MICRODISCHARGES; PLASMA CATALYSIS; TWO DIMENSIONAL FLUID MODEL;

ELECTRON TEMPERATURE;

EID: 84949449724     PISSN: 09263373     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apcatb.2015.12.009     Document Type: Article

References (49)

1. Neyts E.C., Ostrikov K., Sunkara M.K., Bogaerts A. Chem. Rev. 2015, 10.1021/acs.chemrev.5b00362.
2. Chen H.L., Lee H.M., Chen S.H., Chao Y., Chang M.B. Appl. Catal. B Environ. 2008, 85:1.
3. Van Durme J., Dewulf J., Leys C., Van Langenhove H. Appl. Catal. B Environ. 2008, 78:324.
4. Chen H.L., Lee H.M., Chen S.H., Chang M.B., Yu S.J., Li S.N. Environ. Sci. Technol. 2009, 43:2216.
5. Whitehead J.C. Pure Appl. Chem. 2010, 82:1329.
6. Neyts E.C., Bogaerts A. J. Phys. D Appl. Phys. 2014, 47:224010.
7. Song H.K., Choi J.W., Yue S.H., Lee H., Na B.K. Catal. Today 2004, 89:27.
8. Nozaki T., Muto N., Kado S., Okazaki K. Catal. Today 2004, 89:57.
9. Van Durme J., Dewulf J., Sysmans W., Leys C., Van Langenhove H. Appl. Catal. B Environ. 2007, 74:161.
10. Wang H., Li J., Quan X., Wu Y. Appl. Catal. B Environ. 2008, 83:72.
11. Tu X., Gallon H.J., Twigg M.V., Gorry P.A., Whitehead J.C. J. Phys. D Appl. Phys. 2011, 44:274007.
12. Gallon H.J., Tu X., Whitehead J.C. Plasma Proc. Polym. 2012, 9:90.
13. Spencer L.F., Gallimore A.D. Plasma Sources Sci. Technol. 2013, 22:015019.
14. Kim H.H., Ogata A., Futamura S. Appl. Catal. B Environ. 2008, 79:356.
15. Kim H.H., Ogata A. Eur. Phys. J. Appl. Phys. 2011, 55:13806.
16. Kim H.H., Teramoto Y., Negishi N., Ogata A. Catal. Today 2015, 256:13.
17. Wu C.C., Wu C.I., Sturm J.C., Kahn A. Appl. Phys. Lett. 1997, 70:1348.
18. Pylinina A.I., Mikhalenko I.I. Theor. Exp. Chem. 2013, 49:65.
19. Demidyuk V., Whitehead J.C. Plasma Chem. Plasma Process. 2007, 27:85.
20. Liu C.J., Mallison R., Lobban L. J. Catal. 1998, 179:326.
21. Guo Y.F., Ye D.Q., Chen K.F., He J.C., Chen W.L. J. Mol. Catal. A 2006, 245:93.
22. Neyts E.C. Plasma Chem. Plasma Process. 2015, 10.1007/s11090-015-9662-5.
23. Kang W.S., Park J.M., Kim Y., Hong S.H. IEEE Trans. Plasma Sci. 2003, 31:504.
24. Chang J.S., Kostov K.G., Urashima K., Yamamoto T., Okayasu Y., Kato T., Iwaizumi T., Yoshimura K. IEEE Trans. Ind. Appl. 2000, 36:1251.
25. Takuma T. IEEE Trans. Electr. Insul. 1991, 26:500.
26. Ogata A., Ito D., Mizuno K., Kushiyama S., Yamamoto T. IEEE Trans. Ind. Appl. 2001, 37:959.
27. Rousseau A., Guaitella O., Ropcke J., Gatilova L.V., Tolmachev Y.A. Appl. Phys. Lett. 2004, 85:2199.
28. Holzer F., Roland U., Kopinke F.D. Appl. Catal. B Environ. 2002, 38:163.
29. Roland U., Holzer F., Kopinke F.D. Appl. Catal. B Environ. 2005, 58:217.
30. Holzer F., Kopinke F.D., Roland U. Plasma Chem. Plasma Process. 2005, 25:595.
31. Hensel K., Katsura S., Mizuno A. IEEE Trans. Plasma Sci. 2005, 33:574.
32. Hensel K., Martisovits V., Machala Z., Janda M., Lestinsky M., Tardiveau P., Mizuno A. Plasma Process. Polym. 2007, 4:682.
33. Hensel K. Eur. Phys. J. D 2009, 54:141.
34. Chang M.B., Balbach J.H., Rood M.J., Kushner M.J. J. Appl. Phys. 1991, 69:4409.
35. Subrahmanyam Ch., Magureanu M., Renken A., Kiwi-Minsker L. Appl. Catal. B Environ. 2006, 65:150.
36. Michels N.-L., Mitchell S., Milina M., Kunze K., Krumeich F., Marone F., Erdmann M., Marti N., Perez-Ramirez J. Adv. Funct. Mater. 2012, 22:2509.
37. Lefevere J., Gysen M., Mullens S., Meynen V., Van Noyen J. Catal. Today 2013, 216:18.
38. Lefevere J., Mullens S., Meynen V., Van Noyen J. Chem. Pap. 2014, 68:1143.
39. Gascon J., van Ommen J.R., Moulijn J.A., Kapteijn F. Catal. Sci. Technol. 2015, 5:807.
40. Comsol Website;. http://www.comsol.com.
41. Kogelschatz U. Plasma Chem. Plasma Process. 2003, 23:1.
42. Yokoyama T., Kogoma M., Moriwaki T., Okazaki S. J. Phys. D Appl. Phys. 1990, 23:1125.
43. Van Laer K., Bogaerts A. Energy Technol. 2015, 3:1038.
44. Hagelaar G.J.M., Pitchford L.C. Plasma Sources Sci. Technol. 2005, 14:722.
45. Morgan database, retrieved on July 25, 2013. http://www.lxcat.net.
46. Martens T., Bogaerts A., Brok W., van Dijk J. Anal. Bioanal. Chem. 2007, 288:1583.
47. Wang Q., Economou D.J., Donnelly V.M. J. Appl. Phys. 2006, 100:023301.
48. Patterson P.L. Phys. Rev. A 1970, 2:1154.
49. Bhoj A.N., Kushner M.J. Plasma Sources Sci. Technol. 2008, 17:035024.