Nonthermal plasma activates catalyst: From current understanding and future prospects

EPJ Applied Physics

Volumn 55, Issue 1, 2011, Pages

  Kim, H H ^a   Ogata, A ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION CAPACITIES; ADVANCED PROCESS; CATALYST SCREENING; DISCHARGE PLASMA; ENHANCEMENT FACTOR; FUTURE PROSPECTS; ICCD CAMERAS; NONTHERMAL PLASMA; ROOM TEMPERATURE; VISUAL OBSERVATIONS;

ADSORPTION; AIR POLLUTION CONTROL; AIR QUALITY; ATMOSPHERIC PRESSURE; CATALYSIS; ELECTRIC DISCHARGES; PLASMAS;

CATALYSTS;

EID: 80051994196     PISSN: 12860042     EISSN: 12860050     Source Type: Journal    
DOI: 10.1051/epjap/2011100444     Document Type: Conference Paper

References (56)

1. F.O. Anderegg, Trans. Am. Electrochemical Soc. 44, 203 (1923)
2. P.T. Newsome, J. Am. Chem. Soc. 48, 2035 (1926)
3. K.J. Boelter, J.H. Davidson, Aerosol Sci. Technol. 27, 689 (1997)
4. A. Yehia, A. Mizuno, Int. J. Plasma Environ. Sci. Technol. 2, 44 (2008)
5. A.A. Petrov, R.H. Amirov, I.S. Samoylov, IEEE Trans. Plasma Sci. 37, 1146 (2009)
6. J.M. Henis, Nitrogen oxide decomposition process. U.S. Patent 3,983,021, 1976
7. H.H. Kim, A. Ogata, S. Futamura, Appl. Catal. B: Environ. 79, 356 (2008)
8. M. Simek, M. Clupek, J. Phys. D: Appl. Phys. 35, 1171 (2002)
9. S. Yagi, M. Tanaka, J. Phys. D: Appl. Phys. 12, 1509 (1979)
10. B.M. Penetrante, M.C. Hsiao, B.T. Merritt, G.E. Vogtlin, P.H. Wallman, IEEE Trans. Plasma Sci. 23, 679 (1995)
11. K. Yan, S. Kanazawa, T. Ohkubo, Y. Nomoto, T. IEE Japan 119-A, 731 (1999)
12. M.A. Jani, K. Takaki, T. Fujiwara, J. Phys. D: Appl. Phys. 32, 2560 (1999)
13. J. Jarrige, P. Vervisch, J. Appl. Phys. 99, 113303 (2006)
14. H.H. Kim, A. Ogata, S. Futamura, J. Phys. D: Appl. Phys. 38, 1292 (2005)
15. J.J. Spivey, Ind. Eng. Chem. Res. 26, 2165 (1987)
16. T. Yamamoto, streams. J. Hazard. Mater. B 67, 165 (1999)
17. T.J. Wallington, J.W. Hoard, M.P. Sulbaekandersen, M.D. Hurley, Y. Nakano, M. Kawasaki, Environ. Sci. Technol. 37, 4242 (2003)
18. Y.H. Song, S.J. Kim, K.I. Choi, T. Yamamoto, J. Electrostat. 55, 189 (2002)
19. S. Futamura, Z. Zhang, T. Yamamoto, IEEE Trans. Ind. Appl. 35, 760 (1999)
20. Z. Bo, J. Yan, X. Li, Y. Chi, K. Cen, J. Hazard. Mater. 166, 1210 (2009)
21. A. Ogata, N. Shintani, K. Mizuno, S. Kushiyama, T. Yamamoto, IEEE Trans. Ind. Appl. 35, 753 (1999)
22. S. Masuda, S. Hosokawa, X. Tu, K. Sakakibara, S. Kitoh, S. Sakai, IEEE Trans. Ind. Applicat. 29, 781 (1993)
23. K. Yan, S. Kanazawa, T. Ohkubo, Y. Nomoto, Plasma Chem. Plasma Proc. 19, 421 (1999)
24. T. Kuroki, K. Hirai, R. Kawabata, M. Okubo, T. Yamamoto, IEEE Trans. Ind. Applicat. 46, 672 (2010)
25. A. Rousseau, A. Dantier, L. Gatilova, Y. Ionikh, J. Ropcke, Y. Tolmachev, Plasma Sources Sci. Technol. 14, 70 (2005)
26. Y.P. I, Y.C. Liu, K.Y. Han, T.C. She, Environ. Sci. Technol. 38, 3785 (2004)
27. S. Futamura, Z. Zhang, G. Prieto, T. Yamamoto, IEEE Trans. Ind. Appl. 34, 967 (1998)
28. H.H. Kim, S.M. Oh, A. Ogata, S. Futamura, J. Adv. Oxid. Technol. 8, 226 (2005)
29. H.Y. Fan, C.S. Shi, X.S. Li, D.X. Zhao, Y. Xu, A.M. Zhu, J. Phys. D: Appl. Phys. 42, 225105 (2009)
30. H.H. Kim, J.H. Kim, A. Ogata, J. Phys. D: Appl. Phys. 42, 135210 (2009)
31. A. Mizuno, H. Ito, J. Electrostat. 25, 97 (1990)
32. H. Arai, A. Ogata, A. Yamasaki, H.H. Kim, Y. Yanagisawa, Kagaku Kougaku Ronbunsyu 36, 310 (2010)
33. H.L. Chen, H.M. Lee, S.H. Chen, M.B. Chang, S.J. Yu, S.N. Li, Environ. Sci. Technol. 43, 2216 (2009)
34. H.H. Kim, A. Ogata, S. Futamura, IEEE Trans. Plasma Sci. 34, 984 (2006)
35. C. Subrahmanyam, A. Renken, L. Kiwi-Minsker, Plasma Chem. Plasma Proc. 27, 13 (2007)
36. C. Ayrault, J. Barrault, N. Blin-Simiand, F. Jorand, S. Pasquiers, A. Rousseau, J.M. Tatibouet, Catal. Today 89, 75 (2004)
37. T. Hakoda, K. Matsumoto, A. Mizuno, T. Kojima, K. Hirota, Plasma Chem. Plasma Proc. 28, 25 (2008)
38. A.B. Ray, F.O. Anderegg, J. Am. Chem. Soc. 43, 967 (1921)
39. A. Naydenov, R. Stoyanova, D. Mehandjiev, J. Mol. Catal. A: Chemical 98, 9 (1995)
40. P. Konova, A. Naydenov, T. Tabakova, D. Mehandjiev, Catal. Commun. 5, 537 (2004)
41. H.H. Kim, S. Katsura, A. Mizuno, in NOx control using combination process of photocatalyst and discharge plasma, 2nd International Symposium on Non-Thermal Plasma Technology (ISNTPT-2) (Salvador, Brazil, 1997; Salvador, Brazil, 1997)
42. H.H. Kim, K. Tsunoda, S. Katsura, A. Mizuno, IEEE Trans. Ind. Appl. 35, 1306 (1999)
43. A. Mizuno, Y. Kisanuki, M. Noguchi, S. Katsura, S.H. Lee, Y.K. Hong, S.Y. Shin, J.H. Kang, IEEE Trans. Ind. Appl. 35, 1284 (1999)
44. D. Li, D. Yakushiji, S. Kanazawa, T. Ohkubo, Y. Nomoto, J. Electrostat. 55, 311 (2002)
45. T. Sano, N. Negishi, E. Sakai, S. Matsuzawa, J. Mol. Catal. A: Chemical, 235 (2006)
46. H.B. Huang, D.Q. Ye, M.L. Fu, F.D. Feng, Plasma Chem. Plasma Proc. 27, 577 (2007)
47. R. Oikari, V. Hayrinen, R. Hernbert, J. Phys. D: Appl. Phys. 35, 1109 (2002)
48. K. Hashimoto, H. Irie, A. Fujihsima, Jpn J. Appl. Phys. 44, 8269 (2005)
49. X. Lu, M. Laroussi, J. Appl. Phys. 98, 023301 (2005)
50. H.H. Kim, A. Ogata, M. Schiorlin, E. Marotta, C. Paradisi, Catal. Lett. 141, 227 (2011)
51. O. Guaitella, M. Hubner, S. Welzel, D. Marinov, J. Ropcke, A. Rousseau, Plasma Sources Sci. Technol. 19, 045206 (2010)
52. J.V. Durme, J. Dewulf, W. Sysmans, C. Leys, H.V. Langenhove, Appl. Catal. B: Environ. 74, 161 (2007)
53. H. Huang, D. Ye, X. Guan, Catal. Today 139, 43 (2008)
54. A. Ogata, K. Saito, H.H. Kim, M. Sugasawa, H. Aritani, H. Einaga, Plasma Chem. Plasma Proc. 30, 33 (2010)
55. S. Sato, K. Hensel, H. Hayashi, K. Takashima, A. Mizuno, J. Electrostat. 67, 77 (2009)
56. K. Hensel, S. Sato, A. Mizuno, IEEE Trans. Plasma Sci. 36, 1282 (2008)