Comparison of bulk and SOI CMOS technologies in a DSP processor circuit implementation

Proceedings of the International Conference on Microelectronics, ICM

Volumn 2001-January, Issue , 2001, Pages 107-110

  Simonen, Piia ^a   Heinonen, Aarne ^a   Kuulusa, Mika ^a   Nurmi, Jari ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; DIGITAL INTEGRATED CIRCUITS; DIGITAL SIGNAL PROCESSING; ELECTRIC POWER UTILIZATION; LOW POWER ELECTRONICS; MICROELECTRONICS; SILICON ON INSULATOR TECHNOLOGY;

CIRCUIT IMPLEMENTATION; DSP PROCESSOR; HIGH SPEED DIGITAL INTEGRATED CIRCUITS; LAYOUT MIGRATION; LOW POWER APPLICATION; SILICON-ON-INSULATOR CMOS; SOI CIRCUITS; SUPPLY VOLTAGES;

INTEGRATED CIRCUIT LAYOUT;

EID: 84949183533     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICM.2001.997499     Document Type: Conference Paper

References (11)

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