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Volumn 2002-January, Issue , 2002, Pages 73-82

Harnessing the base-pushout effect for ESD protection in bipolar and BiCMOS technologies

Author keywords

BiCMOS integrated circuits; Character generation; Electric breakdown; Electrons; Electrostatic discharge; Kirk field collapse effect; Protection; Radio frequency; Radiofrequency identification; Voltage

Indexed keywords

BICMOS TECHNOLOGY; ELECTRIC BREAKDOWN; ELECTRIC POTENTIAL; ELECTRONS; ELECTROSTATIC DISCHARGE; RADIO FREQUENCY IDENTIFICATION (RFID); RADIO WAVES;

EID: 84948737620     PISSN: 07395159     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (10)

References (9)
  • 1
    • 4244109543 scopus 로고
    • Accurate Modeling and Numerical Techniques in Simulation of Impact-Ionization Effects on BJT Characteristics
    • Z. Yu, D. Chen, R.J.G. Goossens, and R.W. Dutton, "Accurate Modeling and Numerical Techniques in Simulation of Impact-Ionization Effects on BJT Characteristics," IEDM Tech. Dig., 1991, pp. 901-904.
    • (1991) IEDM Tech. Dig. , pp. 901-904
    • Yu, Z.1    Chen, D.2    Goossens, R.J.G.3    Dutton, R.W.4
  • 3
    • 84937658108 scopus 로고
    • A theory of transistor cutoff frequency (f t) falloff at high current densities
    • Mar.
    • C.T. Kirk, "A theory of transistor cutoff frequency (f t) falloff at high current densities", IRE Trans. Electron Dev., Mar. 1962, pp. 164-174.
    • (1962) IRE Trans. Electron Dev. , pp. 164-174
    • Kirk, C.T.1
  • 6
    • 0005963032 scopus 로고    scopus 로고
    • Silicon Germanium Heterojunction Bipolar Transistor ESD Power Clamps and the Johnson Limit
    • S.H. Voldman, A. Botula, D. T. Hui, and P. A. Juliano, "Silicon Germanium Heterojunction Bipolar Transistor ESD Power Clamps and the Johnson Limit," Proc. EOS/ESD Symp. 2001, pp. 326-336.
    • Proc. EOS/ESD Symp. 2001 , pp. 326-336
    • Voldman, S.H.1    Botula, A.2    Hui, D.T.3    Juliano, P.A.4
  • 8
    • 0032404665 scopus 로고    scopus 로고
    • Characterization of snap back breakdown and its temperature dependence up to 300°C including circuit level model and simulation
    • Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV
    • D. Uffmann, "Characterization of snap back breakdown and its temperature dependence up to 300°C including circuit level model and simulation", Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, Proc. of SPIE 3510, 64-73 (1998).
    • (1998) Proc. of SPIE , vol.3510 , pp. 64-73
    • Uffmann, D.1
  • 9
    • 0009667182 scopus 로고
    • Temperature Dependence of Avalanche Multiplication in Semiconductors
    • C.R. Crowell and S. M. Sze, "Temperature Dependence of Avalanche Multiplication in Semiconductors", Applied Physics Letters, Vol. 9, 1966, P. 242
    • (1966) Applied Physics Letters , vol.9 , pp. 242
    • Crowell, C.R.1    Sze, S.M.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.