On the behavioral modeling of integrated circuit output buffers

Electrical Performance of Electronic Packaging

Volumn , Issue , 2003, Pages 281-284

  Stievano, I S ^a   Canavero, E G ^a   Maio, I A ^a  

^a POLITECNICO DI TORINO   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; INTEGRATED CIRCUITS;

BEHAVIORAL MODEL; MACRO-MODELS; OUTPUT BUFFER; SINGLE-ENDED;

CMOS INTEGRATED CIRCUITS;

EID: 84945249779     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2003.1250050     Document Type: Conference Paper

References (8)

1. "IO Buffer Infoiroaeion Specification (IBIS)" Speciflc-Atioo avaliabie on the web ar http.-www.eigroup.orgibioibiB.htm.
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3. L S. Stievano, I. A. Mao, F G. Canavero, "Parametric Macromodels of Digital ID Ports, " IEEE Transactions on Advanced Packaging. Vol 25. No. 2. pp. 255-264. May 2002.
4. I. S Stievano, I. A Maio, F. G Canavero, "Accurate and Efficeni Parametric Macromodcling of 1C Drivers via Sigmoidal Basis Functions." Proc of 7°" IEEE Workshop on Signal Propagation on Interconnects, Siena, I, pp. 57- 60. May 11-14, 2003.
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6. Y. Wang, "Tbe development of Analog SPICE Behavioral Model Bated on IBIS Model, " Proc. of the 91'' Great Lakes Symposium on VLSI, Ypsilanti. MI, USA, pp. 101-104, Mar. 4-6.1999.
7. B. Ross, '"Introduction & Model Processing Algorithms." IBIS Summit Meeting, Boxboro, MA, USA, Oct. 15, 1998 (available at httpiwww.eda.orgpxibibisaumaLts).
8. L S. Stievano, F. G. Canavero, Z. Chen, G. Katcpis. A. Maio, "Parametria Macromodcls of Drivers for SSN Simulations, " Proc. of IEEE International Symposium on Electromagnetic Compatibility, Barton, MA. USA, Aug 18- 22, 2003.