Post-packaging tuning of microresonators by pulsed laser deposition

TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers

Volumn 2, Issue , 2003, Pages 1820-1823

  Chiao, M ^a   Lin, L ^b  

^a Intpax Inc   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Bonding processes; Hermetic seals; Laser tuning; Microcavities; Optical materials; Optical pulses; Packaging; Pulsed laser deposition; Rapid thermal processing; Resonant frequency

Indexed keywords

ACTUATORS; BONDING; DEPOSITION; HEAT TREATMENT; HERMETIC SEALS; LASER BEAMS; LASER PULSES; LASER TUNING; MICROCAVITIES; MICROSYSTEMS; NATURAL FREQUENCIES; OPTICAL MATERIALS; PACKAGING; PULSED LASER DEPOSITION; PULSED LASERS; RAPID THERMAL PROCESSING; RESONATORS; SILICON NITRIDE; SOLID-STATE SENSORS; TRANSDUCERS;

ADDING MATERIALS; BEAM SPOT SIZE; BONDING PROCESS; MICRO RESONATORS; NANO SECONDS; POST-PACKAGING TUNING PROCESS; PULSE DURATIONS; TUNING RESOLUTIONS;

LASER MATERIALS PROCESSING;

EID: 84944749252     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2003.1217141     Document Type: Conference Paper

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