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Volumn 2003-January, Issue , 2003, Pages 89-95

High coverage analog wafer-probe test design and co-optimization with assembled-package test to minimize overall test cost

Author keywords

Assembly; Costs; Testing; Very large scale integration

Indexed keywords

ANALOG INTEGRATED CIRCUITS; ASSEMBLY; COSTS; INTEGRATED CIRCUIT DESIGN; INTEGRATION TESTING; TESTING; VLSI CIRCUITS;

EID: 84943554243     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/VTEST.2003.1197638     Document Type: Conference Paper
Times cited : (2)

References (10)
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  • 2
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  • 4
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    • M.Salamani, B.Kaminska and G.Quesnel, " An integrated approach for analog circuit testing with minimum number of detected parameters," Intl. Test Conf., pp. 631-640, 1994.
    • (1994) Intl. Test Conf. , pp. 631-640
    • Salamani, M.1    Kaminska, B.2    Quesnel, G.3
  • 5
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  • 7
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    • P.N.Variyam and A.Chatterjee, "Test Generation for comprehensive testing of linear analog circuits using transient response sampling," Intl. Conf. on Computer Aided Design, pp.382-385, 1997
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  • 8
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  • 10
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.