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Volumn 23, Issue 6, 2012, Pages 1025-1028

Thermal conductivity epoxy resin composites filled with boron nitride

Author keywords

Boron nitride; Epoxy resin; Thermal conductivity

Indexed keywords

AMINOPROPYL; EPOXY RESIN COMPOSITES; MASS FRACTION; MICRO PARTICLES; SILANE COUPLING AGENT; THERMAL CONDUCTIVITY COEFFICIENT; THERMAL DECOMPOSITION TEMPERATURE;

EID: 84860522203     PISSN: 10427147     EISSN: 10991581     Source Type: Journal    
DOI: 10.1002/pat.2063     Document Type: Article
Times cited : (261)

References (28)
  • 3
    • 84860521828 scopus 로고    scopus 로고
    • ICMIME 2011, Australia, Melbourne
    • J. Dang, J. W. Gu, Y. S. Tang, G. C. Zhang, ICMIME 2011, Australia, Melbourne, 2011, 442-444.
    • (2011) , pp. 442-444
    • Dang, J.1    Gu, J.W.2    Tang, Y.S.3    Zhang, G.C.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.