A technology for a device prototyping based on electrodeposited thermoelectric V-VI layers

International Conference on Thermoelectrics, ICT, Proceedings

Volumn 2003-January, Issue , 2003, Pages 661-664

  Diliberto, S ^a   Michel, S ^a   Boulanger, C ^a   Lecuire, J M ^a   Jagle M ^b   Drost, S ^b   Bottner H ^b  

^a INSTITUT JEAN LAMOUR   (France)

^b FRAUNHOFER INSTITUTE FOR PHYSICAL MEASUREMENT TECHNIQUES IPM   (Germany)

Author keywords

Bismuth; Bonding; Chemical technology; Fabrication; Measurement techniques; Microelectronics; Prototypes; Thermoelectric devices; Thermoelectricity; Wet etching

Indexed keywords

BISMUTH; BISMUTH COMPOUNDS; BONDING; CHEMICAL BONDS; CORROSION; ELECTRODEPOSITION; ELECTRODES; FABRICATION; MICROELECTRONICS; THERMOELECTRICITY; WAFER BONDING; WET ETCHING;

BISMUTH-TELLURIDE COMPOUNDS; CHEMICAL TECHNOLOGIES; ELECTRODEPOSITION TECHNOLOGY; ELECTROPLATED LAYERS; MEASUREMENT TECHNIQUES; PHYSICAL MEASUREMENT; PROTOTYPES; THERMOELECTRIC DEVICES;

REACTIVE ION ETCHING;

EID: 84941347109     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICT.2003.1287599     Document Type: Conference Paper

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