Prediction of interface dielectric relaxations in bimodal brush functionalized epoxy nanodielectrics by finite element analysis method

2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014

Volumn , Issue , 2014, Pages 748-751

  Huang, Yanhui ^a   Krentz, Timothy M ^a   Nelson, J Keith ^a   Schadler, Linda S ^a   Li, Yang ^b   Zhao, He ^b   Brinson, L Catherine ^b   Bell, Michael ^c   Benicewicz, Brian ^c   Wu, Ke ^a   Breneman, Curt M ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b Northwestern University   (United States)

^c UNIVERSITY OF SOUTH CAROLINA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC PROPERTIES OF SOLIDS; DIELECTRIC RELAXATION; GRAFTING (CHEMICAL); SILICA;

DIELECTRIC RELAXATION BEHAVIOR; DIELECTRIC SPECTRA; FILLER DISTRIBUTION; FINITE ELEMENT ANALYSIS METHOD; FITTING PARAMETERS; INTERFACE PROPERTY; INTERFACIAL AREAS; PROPERTIES OF COMPOSITES;

FINITE ELEMENT METHOD;

EID: 84936773732     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CEIDP.2014.6995897     Document Type: Conference Paper

References (11)

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