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Volumn 4, Issue 5, 2015, Pages 665-673

Ultrastretchable and flexible copper interconnect-based smart patch for adaptive thermotherapy

Author keywords

Copper; Flexibility; Pain management; Stretchability; Thermal patches

Indexed keywords

CMOS INTEGRATED CIRCUITS; COPPER; COSTS; MOS DEVICES; OXIDE SEMICONDUCTORS; REUSABILITY;

EID: 84928352294     PISSN: 21922640     EISSN: 21922659     Source Type: Journal    
DOI: 10.1002/adhm.201400647     Document Type: Article
Times cited : (72)

References (56)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.