Degradation of silicone in white LEDs during device operation: A finite element approach to product reliability prediction

Microelectronics Reliability

Volumn 55, Issue 5, 2015, Pages 733-737

  Watzke, S ^a   Altieri Weimar, P ^a  

^a OSRAM OPTO SEMICONDUCTORS GMBH   (Germany)

Author keywords

Degradation; FEM; LED; Reliability; Silicone

Indexed keywords

CRACKS; DEGRADATION; FINITE ELEMENT METHOD; RELIABILITY; SHRINKAGE; SILICONES;

EXPERIMENTAL INVESTIGATIONS; FINITE-ELEMENT APPROACH; MATERIAL SHRINKAGE; OPERATION CONDITIONS; PACKAGING COMPONENTS; PRODUCT RELIABILITY; STEADY-STATE OPERATION; STRESS SIMULATIONS;

LIGHT EMITTING DIODES;

EID: 84926249781     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2015.02.008     Document Type: Conference Paper

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