The study of thermal properties and thermal resistant behaviors of siloxane-modified LED transparent encapsulant

Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT

Volumn , Issue , 2007, Pages 246-249

  Li, Hsun Tien ^a   Hsu, Chia Wen ^a   Chen, Kai Chi ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DISSOLUTION; DRYING; EPOXY RESINS; ERROR ANALYSIS; ETHERS; HEAT STORAGE; MECHANICAL PROPERTIES; MICROSYSTEMS; ORGANIC COMPOUNDS; PAINTING; PHENOLS; PHOTOMASKS; RESINS; TECHNOLOGY; TESTING; THERMAL SPRAYING; THERMODYNAMIC PROPERTIES;

APPLICATIONS.; CO-CURED; CO-CURING; COEFFICIENT OF THERMAL EXPANSION; CROSS-LINK DENSITIES; DIGLYCIDYL ETHER OF BISPHENOL-A; DISILOXANE; ENCAPSULANT; EPOXY GROUPS; EQUIVALENT RATIOS; HIGH THERMAL; MAIN CHAINS; MODIFIED EPOXY; NORBORANE; SILOXANE STRUCTURES; TETRA METHYL; THERMAL PROPERTIES;

THERMAL EXPANSION;

EID: 48649100067     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2007.4433609     Document Type: Conference Paper

References (4)

1. Ann W. Norris, Maneesh Bahadur, and Maloto Yoshitake, "Novel Silicone Materials for LED Packaging" Proc. of SPIE Vol. 5941 594115-1.
2. US Patent: US2005/0282976A1
3. US Patent: US6632592B2
4. Hsun-Tien Li, Hsun-Ren Chuang, Ming-Wei Wang and Mu-Shih Lin, "Synthesis, Properties and pyrolysis of siloxane- and imide-modified epoxy resin cured with siloxane-containg dianhydride" Polym. Int. 54: 1416-1421 (2005). 251-254