Silicone materials for LED packaging

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6337, Issue , 2006, Pages

  Bahadur, Maneesh ^a   Norris, Ann W ^a   Zarisfi, Afrooz ^a   Alger, James S ^a   Windiate, Christopher C ^a  

^a DOW CHEMICAL COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LIQUID INJECTION MOLDABLE (LIM); SILICONE MATERIALS; WIRE BOND PROTECTION;

COMPOSITION; ENCAPSULATION; LIGHT EMITTING DIODES; REFRACTIVE INDEX; SILICONES;

ELECTRONICS PACKAGING;

EID: 33751083617     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.681715     Document Type: Conference Paper

References (7)

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7. US Patent Application Publication US20060105485A1.