An exploration of binder jetting of copper

Rapid Prototyping Journal

Volumn 21, Issue 2, 2015, Pages 177-185

  Bai, Yun ^a   Williams, Christopher B ^a  

^a Virginia Polytechnic Institute and State University   (United States)

Author keywords

3D printing; Additive manufacturing; Binder jetting; Copper; Powder metallurgy; Sintering

Indexed keywords

3D PRINTERS; ADDITIVES; COPPER; COPPER POWDER; ELECTRONICS INDUSTRY; INDUSTRIAL RESEARCH; PARTICLE SIZE; POWDER METALLURGY;

3-D PRINTING; DESIGN AND MANUFACTURES; DESIGN/METHODOLOGY/APPROACH; ELECTRICAL AND MECHANICAL PROPERTIES; INHERENT LIMITATIONS; MANUFACTURING PROCESS; MANUFACTURING TECHNIQUES; THERMAL MANAGEMENT SYSTEMS;

SINTERING;

EID: 84925292467     PISSN: 13552546     EISSN: None     Source Type: Journal    
DOI: 10.1108/RPJ-12-2014-0180     Document Type: Article

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