Bonding characteristics during very high power ultrasonic additive manufacturing of copper

Scripta Materialia

Volumn 62, Issue 8, 2010, Pages 560-563

  Sriraman, M R ^a   Babu, S S ^a   Short, M ^b  

^a OHIO STATE UNIVERSITY   (United States)

^b EDISON WELDING INSTITUTE   (United States)

Author keywords

Copper; Dynamic recrystallization; Electron backscattering diffraction; Ultrasonic additive manufacturing; Welding

Indexed keywords

ADDITIVE MANUFACTURING; BONDING CHARACTERISTICS; COARSE-GRAINED STRUCTURE; COPPER FOILS; ELECTRON BACKSCATTERING DIFFRACTION; GRAIN BOUNDARY MIGRATIONS; HIGH-POWER ULTRASONICS; METALLURGICAL BONDING; RECRYSTALLIZED GRAINS; ROOM TEMPERATURE;

BACKSCATTERING; BONDING; COPPER; DIFFRACTION; ELECTRON SCATTERING; GRAIN BOUNDARIES; MANUFACTURE; ULTRASONICS; WELDING;

DYNAMIC RECRYSTALLIZATION;

EID: 76549127594     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2009.12.040     Document Type: Article

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