Novel precipitate-microstructural architecture developed in the fabrication of solid copper components by additive manufacturing using electron beam melting

Acta Materialia

Volumn 59, Issue 10, 2011, Pages 4088-4099

  Ramirez, D A ^a   Murr, L E ^a   Martinez, E ^a   Hernandez, D H ^a   Martinez, J L ^a   MacHado, B I ^a   Medina, F ^a   Frigola, P ^b   Wicker, R B ^a  

^a University of Texas at El Paso   (United States)

^b RadiaBeam Technologies LLC   (United States)

Author keywords

Copper; EBM (electron beam melting); Equiaxed precipitate; SEM (scanning electron microscope); TEM (transmission electron microscope)

Indexed keywords

ADDITIVE MANUFACTURING; BASE PLATES; BUILD DIRECTION; COPPER COMPONENTS; DISLOCATION CELLS; EBM (ELECTRON BEAM MELTING); EQUIAXED PRECIPITATE; EQUIAXED PRECIPITATES; HIGH DENSITY; MICRO-STRUCTURAL; MICROINDENTATION HARDNESS; OPTICAL METALLOGRAPHY; REFERENCE PLANE; SCANNING AND TRANSMISSION ELECTRON MICROSCOPY; SEM; SPATIAL DIMENSION; TEM;

ARCHITECTURE; COPPER; COPPER POWDER METALLURGY; ELECTRON BEAM FURNACES; ELECTRON BEAM MELTING; ELECTRON BEAMS; ELECTRON MICROSCOPES; ELECTRON OPTICS; HARDNESS; MANUFACTURE; MELTING; PRECIPITATES; SCANNING; SCANNING ELECTRON MICROSCOPY; TEXTURES; TRANSMISSION ELECTRON MICROSCOPY;

ELECTRONS;

EID: 79955550382     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2011.03.033     Document Type: Article

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