Simple and low cost integration of highly conductive three-dimensional electrodes in microfluidic devices

Biomedical Microdevices

Volumn 17, Issue 1, 2015, Pages

  Puttaswamy, Srinivasu Valagerahally ^a   Xue, Peng ^b   Kang, Yuejun ^b   Ai, Ye ^a  

^a SINGAPORE UNIVERSITY OF TECHNOLOGY AND DESIGN   (Singapore)

^b Nanyang Technological University   (Singapore)

Author keywords

3D Microelectrodes; Dielectrophoresis; Low cost fabrication; Microfluidics; Particle manipulation

Indexed keywords

ADHESIVES; COST EFFECTIVENESS; COSTS; ELECTROPHORESIS; FLUIDIC DEVICES; MICROELECTRODES;

CONDUCTIVE ADHESIVE; CONDUCTIVE COMPOSITES; LOW COST FABRICATION; LOW COST INTEGRATION; MICRO FLUIDIC APPLICATIONS; MICRO-FLUIDIC DEVICES; PARTICLE MANIPULATION; THREE-DIMENSIONAL ELECTRODE;

MICROFLUIDICS;

ADHESIVE AGENT; CARBON; SOLVENT;

ARTICLE; COST; ELECTRIC FIELD; ELECTRODE; EVAPORATION; MICROELECTRODE; MICROFLUIDICS; MICROTECHNOLOGY; PRIORITY JOURNAL; THREE DIMENSIONAL ELECTRODE; DEVICES; ECONOMICS; MICROCHIP ELECTROPHORESIS; PROCEDURES;

ELECTRODES; ELECTROPHORESIS, MICROCHIP;

EID: 84922238787     PISSN: 13872176     EISSN: 15728781     Source Type: Journal    
DOI: 10.1007/s10544-014-9913-x     Document Type: Article

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