Pressure drop and heat transfer in a single-phase micro-pin-fin heat sink

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn , Issue , 2006, Pages

  Siu Ho, Abel M ^a   Qu, Weilin ^a   Pfefferkorn, Frank ^b  

^a University of Hawaii at Manoa   (United States)

^b University of Wisconsin Madison   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEIONIZED WATER; HEAT FLUX; HEAT TRANSFER; PRESSURE DROP; REYNOLDS NUMBER; TEMPERATURE DISTRIBUTION;

COOLING LIQUID; SINGLE-PHASE MICRO-PIN-FIN HEAT SINK;

HEAT SINKS;

EID: 84920630361     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2006-14777     Document Type: Conference Paper

References (10)

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2. Phillips, R.J., 1990, "Micro-Channel Heat Sinks," Advances in Thermal Modeling of Electronic Components, A. Bar-Cohen, and A.D. Kraus, eds., ASME Press, New York, 2, pp. 109-184.
3. Fedorov, A.G., and Viskanta, R., 2000, "Three-Dimensional Conjugate Heat Transfer in the MicroChannel Heat Sink for Electronic Packaging," International Journal of Heat and Mass Transfer, 43, pp. 399-415.
4. Qu, W., and Mudawar, I., 2002, "Experimental and Numerical Study of Pressure Drop and Heat Transfer in a Single-Phase Micro-Channel Heat Sink," International Journal of Heat and Mass Transfer, 45, pp. 2549-2565.
5. Marques, C. and Kelly, K.W., 2004, "Fabrication and Performance of a Pin Fin Micro Heat Exchanger," ASME Journal of Heat Transfer, 126, pp. 434-444.
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7. Peles, Y., Kosar, A., Mishra, C., Kuo, C.-J., and Schneider, B., 2005, "Forced Convective Heat Transfer across a Pin Fin Micro Heat Sink," International Journal of Heat and Mass Transfer, 48, pp. 3615-3627.
8. Todreas, N.E., and Kazimi, M.S., 1990, Nuclear Systems I, Hemisphere, New York, Chap. 7.
9. Moores, K.A., and Joshi, Y.K., 2003, "Effect of Tip Clearance on the Thermal and Hydrodynamic Performance of a Shrouded Pin Fin Array," ASME Journal of Heat Transfer, 125, pp. 999-1006.
10. Chyu, M.K., Hsing, Y.C., Shih, T.I.-P., and Natarajan, V., 1999, "Heat transfer Contributions of Pins and Endwall in Pin-Fin Arrays: Effects of Thermal Boundary Condition Modeling," ASME Journal of Turbomachinery, 121, pp. 257-263.