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Volumn 121, Issue 2, 1999, Pages 257-263

Heat transfer contributions of pins and endwall in pin-fin arrays: Effects of thermal boundary condition modeling

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COOLING; FINS (HEAT EXCHANGE); HEAT TRANSFER COEFFICIENTS; MASS TRANSFER; THERMAL EFFECTS;

EID: 0032840252     PISSN: 0889504X     EISSN: 15288900     Source Type: Journal    
DOI: 10.1115/1.2841309     Document Type: Article
Times cited : (198)

References (18)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.