Multifunctional skin-like electronics for quantitative, clinical monitoring of cutaneous wound healing

Advanced Healthcare Materials

Volumn 3, Issue 10, 2014, Pages 1597-1607

  Hattori, Yoshiaki ^a   Falgout, Leo ^a   Lee, Woosik ^b   Jung, Sung Young ^c   Poon, Emily ^d   Lee, Jung Woo ^a   Na, Ilyoun ^c   Geisler, Amelia ^d   Sadhwani, Divya ^d   Zhang, Yihui ^e,f   Su, Yewang ^e,f   Wang, Xiaoqi ^d   Liu, Zhuangjian ^g   Xia, Jing ^e,f   Cheng, Huanyu ^e   Webb, R Chad ^a   Bonifas, Andrew P ^a   Won, Philip ^a   Jeong, Jae Woong ^a   Jang, Kyung In ^a   Song, Young Min ^h   Nardone, Beatrice ^d   Nodzenski, Michael ^d   Fan, Jonathan A ^a   Huang, Yonggang ^e   West, Dennis P ^d   Paller, Amy S ^d   Alam, Murad ^d   Yeo, Woon Hong ⁱ   Rogers, John A ^a   more..

^a United States of America   (United States)

^b UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^c Pohang University of Science and Technology (POSTECH)   (South Korea)

^d NORTHWESTERN UNIVERSITY   (United States)

^e Northwestern University   (United States)

^f TSINGHUA UNIVERSITY   (China)

^g INSTITUTE OF HIGH PERFORMANCE COMPUTING   (Singapore)

^h Pusan National University   (South Korea)

ⁱ Virginia Commonwealth University   (United States)

Author keywords

Clinical study; Epidermal electronics; Multifunctional; Skin like; Wound monitoring

Indexed keywords

SURGERY;

BIOMEDICAL DEVICES; CLINICAL MONITORING; CLINICAL STUDY; ELECTRONICS SYSTEM; MULTIFUNCTIONAL; PRACTICAL PROCEDURES; QUANTITATIVE MEASUREMENT; SENSING MODALITIES;

THERMAL CONDUCTIVITY;

ARTICLE; CONTROLLED STUDY; ELECTRONIC SENSOR; EQUIPMENT DESIGN; MECHANICS; PHYSIOLOGIC MONITORING; PRIORITY JOURNAL; PROCESS OPTIMIZATION; QUANTITATIVE ANALYSIS; SIMULATION; SKIN INJURY; THERMAL CONDUCTIVITY; WOUND HEALING; AGED; CLINICAL TRIAL; DEVICES; ELECTRONICS; FEMALE; HUMAN; MALE; MIDDLE AGED; PHYSIOLOGY; SKIN TEMPERATURE; SURGICAL TAPE; THERMOGRAPHY;

SILICONE DERIVATIVE;

AGED; ELECTRONICS, MEDICAL; EQUIPMENT DESIGN; FEMALE; HUMANS; MALE; MIDDLE AGED; MONITORING, PHYSIOLOGIC; SILICONES; SKIN TEMPERATURE; SURGICAL TAPE; THERMOGRAPHY; WOUND HEALING;

EID: 84918828095     PISSN: 21922640     EISSN: 21922659     Source Type: Journal    
DOI: 10.1002/adhm.201400073     Document Type: Article

References (45)

1. T. R. Dargaville, B. L. Farrugia, J. A. Broadbent, S. Pace, Z. Upton, N. H. Voelcker, Biosens. Bioelectron. 2013, 41, 30.
2. J. Panuncialman, S. Hammerman, P. Carson, V. Falanga, J. Invest. Dermatol. 2009, 129, S47.
3. C. T. Hess, R. S. Kirsner, Adv. Skin Wound Care 2003, 16, 246.
4. S. Lange-Asschenfeldt, A. Bob, D. Terhorst, M. Ulrich, J. Fluhr, G. Mendez, H. J. Roewert-Huber, E. Stockfleth, B. Lange-Asschenfeldt, J. Biomed. Opt. 2012, 17, 076016.
5. N. J. Crane, E. A. Elster, J. Biomed. Opt. 2012, 17, 010902.
6. T. Serena, Protease Activity Levels Associated with Healing Status of Chronic Wounds, http://www.systagenix.com/Promo/Product-Wall-2-EWMA-2012/posters/EP429.pdf, 2011.
7. S. Guo, L. A. DiPietro, J. Dent. Res. 2010, 89, 219.
8. G. Matzeu, M. Losacco, E. Parducci, A. Pucci, V. Dini, M. Romanelli, F. Di Francesco, Proc. 37th Annu. Conf. IEEE IECON 2011, 3533.
9. D. McColl, B. Cartlidge, P. Connolly, Int. J. Surg. 2007, 5, 316.
10. D. H. Kim, N. S. Lu, R. Ma, Y. S. Kim, R. H. Kim, S. D. Wang, J. Wu, S. M. Won, H. Tao, A. Islam, K. J. Yu, T. I. Kim, R. Chowdhury, M. Ying, L. Z. Xu, M. Li, H. J. Chung, H. Keum, M. McCormick, P. Liu, Y. W. Zhang, F. G. Omenetto, Y. G. Huang, T. Coleman, J. A. Rogers, Science 2011, 333, 838.
11. J. W. Jeong, W. H. Yeo, A. Akhtar, J. J. S. Norton, Y. J. Kwack, S. Li, S. Y. Jung, Y. W. Su, W. Lee, J. Xia, H. Y. Cheng, Y. G. Huang, W. S. Choi, T. Bretl, J. A. Rogers, Adv. Mater. 2013, 25, 6839.
12. W. H. Yeo, Y. S. Kim, J. Lee, A. Ameen, L. K. Shi, M. Li, S. D. Wang, R. Ma, S. H. Jin, Z. Kang, Y. G. Huang, J. A. Rogers, Adv. Mater. 2013, 25, 2773.
13. W. H. Yeo, R. C. Webb, W. Lee, S. Jung, J. A. Rogers, Proc. SPIE 2013, 8725, 1.
14. T. Helfman, L. Ovington, V. Falanga, Clin. Dermatol. 1994, 12, 121.
15. A. J. Singer, R. A. F. Clark, New Engl. J. Med. 1999, 341, 738.
16. X. Huang, H. Y. Cheng, K. L. Chen, Y. L. Zhang, Y. H. Zhang, Y. H. Liu, C. Q. Zhu, S. C. Ouyang, G. W. Kong, C. J. Yu, Y. G. Huang, J. A. Rogers, IEEE T. Bio-Med. Eng. 2013, 60, 2848.
17. X. Huang, W. H. Yeo, Y. H. Liu, J. A. Rogers, Biointerphases 2012, 7, 52.
18. R. C. Webb, A. P. Bonifas, A. Behnaz, Y. H. Zhang, K. J. Yu, H. Y. Cheng, M. X. Shi, Z. G. Bian, Z. J. Liu, Y. S. Kim, W. H. Yeo, J. S. Park, J. Z. Song, Y. H. Li, Y. G. Huang, A. M. Gorbach, J. A. Rogers, Nat. Mater. 2013, 12, 1078.
19. J. A. Fan, W.-H. Yeo, Y. Su, Y. Hattori, W. Lee, S. Jung, Y. Zhang, Z. Liu, H. Cheng, L. Falgout, M. Bajema, T. Coleman, D. Gregoire, R. Larson, Y. Huang, J. A. Rogers, Nat. Commun. 2013, 5, 3266.
20. J. W. Jeong, M. K. Kim, H. Cheng, W. H. Yeo, X. Huang, Y. Liu, Y. Zhang, Y. Huang, J. A. Rogers, Adv. Healthcare Mater. 2013, DOI: 10.1002/adhm.201300334.
21. Y. M. Song, Y. Z. Xie, V. Malyarchuk, J. L. Xiao, I. Jung, K. J. Choi, Z. J. Liu, H. Park, C. F. Lu, R. H. Kim, R. Li, K. B. Crozier, Y. G. Huang, J. A. Rogers, Nature 2013, 497, 95.
22. J. R. Davis, Asm Specialty Handbook: Copper and Copper Alloys, ASM International Materials Park, OH 2001.
23. W. F. Riley, L. D. Sturges, D. H. Morris, Mechanics of Materials, John Wiley & Sons, New York 1999.
24. Y. H. Zhang, S. Xu, H. R. Fu, J. Lee, J. Su, K. C. Hwang, J. A. Rogers, Y. G. Huang, Soft Matter 2013, 9, 8062.
25. D. G. Cahill, Rev. Sci. Instrum. 1990, 61, 802.
26. M. J. Assael, E. Charitidou, W. A. Wakeham, Int. J. Thermophys. 1989, 10, 793.
27. S. R. Choi, D. Kim, Rev. Sci. Instrum. 2008, 79, 064901.
28. R. Q. Gram, A. She, R. S. Craxton, D. R. Harding, J. Appl. Phys. 2012, 112, 033504.
29. D. Haemmerich, P. F. Laeseke, Int. J. Hyperthermia 2005, 21, 755.
30. D. H. Kim, S. D. Wang, H. Keum, R. Ghaffari, Y. S. Kim, H. Tao, B. Panilaitis, M. Li, Z. Kang, F. Omenetto, Y. G. Huang, J. A. Rogers, Small 2012, 8, 3263.
31. C. J. Gannon, P. Cherukuri, B. I. Yakobson, L. Cognet, J. S. Kanzius, C. Kittrell, R. B. Weisman, M. Pasquali, H. K. Schmidt, R. E. Smalley, S. A. Curley, Cancer-Am. Cancer Soc. 2007, 110, 2654.
32. T. Juang, D. Neuman, J. Schlorff, P. R. Stauffer, IEEE, in Proc. 26th Ann. Int. Conf. IEE Eng. Med. Biol. Soc., Vols 1-7, Vol. 26, IEEE, New York 2004, 3467.
33. Y. S. Koo, A. E. Fathy, R. Kazemi, J. Phillips, IEEE, in: 2012 IEEE Antennas and Propagation Society International Symposium, IEEE, New York 2012.
34. Infection Control Manual, https://practicegreenhealth.org/pubs/sharing/SHC_InfectionControlPolicy_7%2010CleaningofEquipment.pdf, Stanford Hospital and Clinics 2010.
35. G. McDonnell, A. D. Russell, Clin. Microbiol. Rev. 1999, 12, 147.
36. Guideline for Disinfection and Sterilization in Healthcare Facilities, http://www.cdc.gov/hicpac/pdf/guidelines/Disinfection_Nov_2008.pdf, Disease Control Prevention 2008.
37. J. M. Karp, R. Langer, Nature 2011, 477, 42.
38. M. K. Kwak, H. E. Jeong, K. Y. Suh, Adv. Mater. 2011, 23, 3949.
39. M. K. Kwak, C. Pang, H. E. Jeong, H. N. Kim, H. Yoon, H. S. Jung, K. Y. Suh, Adv. Funct. Mater. 2011, 21, 3606.
40. B. Laulicht, R. Langer, J. M. Karp, Proc. Natl. Acad. Sci. U.S.A. 2012, 109, 18803.
41. Y. J. Choi, S. Chae, J. H. Kim, K. F. Barald, J. Y. Park, S. H. Lee, Sci. Rep. 2013, 3, 1921.
42. H. C. Jung, J. H. Moon, D. H. Baek, J. H. Lee, Y. Y. Choi, J. S. Hong, S. H. Lee, IEEE T. Bio-Med. Eng. 2012, 59, 1472.
43. S. M. Lee, J. H. Kim, H. J. Byeon, Y. Y. Choi, K. S. Park, S. H. Lee, J. Neural Eng. 2013, 10, 036006.
44. C. P. Pan, Y. H. Shi, K. Amin, C. S. Greenberg, Z. Haroon, G. W. Faris, Biomed. Opt. Express 2010, 1, 285.
45. D. Queen, H. Orsted, H. Sanada, G. Sussman, Int. Wound J. 2004, 1, 59.