Heterogeneous system integration: A key technology for future microelectronic applications

Smart Systems Integration 2010 - 4th European Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components

Volumn , Issue , 2010, Pages

  Juergen Wolf, M ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84907389706     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)

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3. Reichl, H.; Wolf, M. J.: Hetero System Integration Chal-lenges and Requirements for Packaging, MHSI 2006, Sen-dai, Japan, 6.-7. November 2006
4. Reichl, H.; Wolf, M. J.: "Potential Technologies for Wireless Sensor Nodes". Nano-Manufacturing Technology Pioneering Life Science for Health, Tokyo, Japan 2006
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8. www.ecubes.org
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12. Klumpp et.al. "Chip to Wafer Stacking by using Through Silicon Vias and Solid Liquid Interdiffusion, 2nd Intern. IEEE Workshop on 3D System integration, Munich, Germany, Oct 1st, 2007
13. BMBF Projekt "KASS" FKZ: 01M3163A, 01M3163B
14. www.emc3d.org
15. M. Jürgen Wolf, Thomas Dretschkow, Bernhard Wunderle, Nils Jürgensen, Gunter Engelmann, Oswin Ehr-mann, Albrecht Uhlig, Bernd Michel, Herbert Reichl "High Aspect Ratio TSV Copper Filling with Different Seed Layers". ECTC 2008, May 27-30, Orlando, FL, USA, proc.
16. M. Juergen Wolf, K. Zoschke, A. Klumpp, R. Wieland, M. Klein, L. Nebrich1, A. Heinig, I. Limansyah, W. Weber, O. Ehrmann, H. Reichl "3D Integration of Image Sensor SiP using TSV Silicon Interposer", EPTC 2009, Singapore.