Simultaneous evaluations of material toxicity and ease of disassembly during electronics design: Integrating environmental assessments with commercial computer-aided design software chang and lu evaluating toxicity and ease of disassembly during computer-aided design

Journal of Industrial Ecology

Volumn 18, Issue 4, 2014, Pages 478-490

  Chang, Hsiang Tang ^a   Lu, Chien Han ^a  

^a NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

Author keywords

Application programming interface (API); Design for environment (DfE); EcoCAD; Industrial ecology; Product design; Toxic potential indicator (TPI)

Indexed keywords

APPLICATION PROGRAMMING INTERFACES (API); DATABASE SYSTEMS; GREENHOUSE GASES; LIFE CYCLE; PRODUCT DESIGN; TOXICITY;

COMPUTER-AIDED DESIGN SOFTWARE; DESIGN FOR ENVIRONMENT; ECOCAD; ENVIRONMENTAL CHARACTERISTIC; GLOBALLY HARMONIZED SYSTEM; INDUSTRIAL ECOLOGY; LIFE CYCLE ASSESSMENT DATABASE; TOXIC POTENTIAL;

COMPUTER AIDED DESIGN;

COMPUTER AIDED DESIGN; ELECTRONIC EQUIPMENT; GREENHOUSE GAS; INDUSTRIAL ECOLOGY; SOFTWARE; SUSTAINABLE DEVELOPMENT; TOXICITY;

EID: 84905993904     PISSN: 10881980     EISSN: 15309290     Source Type: Journal    
DOI: 10.1111/jiec.12052     Document Type: Article

References (33)

1. Birkhofer, H. 2011. From design practice to design science: The evolution of a career in design methodology research. Journal of Engineering Design 22(5): 333-359.
2. Chang, H.-T. and J. L. Chen . 2004. The conflict-problem-solving CAD software integrating TRIZ into eco-innovation. Advances in Engineering Software 35(8-9): 553-566.
3. Chu, K.-C. 2001. The study of evaluating environmental impacts in printed circuit board manufacturing. Master's thesis, National Cheng Kung University, Tainan, Taiwan. (in traditional Chinese)
4. Curran, M. A. 1996. Environmental life-cycle assessment. New York: McGraw-Hill.
5. Fiksel, J. 1996. Design for environment: Creating eco-efficient products and processes. New York: McGraw-Hill.
6. Fujino, M., T. Suga, and H. Hamano . 2005. Customization of the toxic potential indicator for Japanese regulation. Paper presented at EcoDesign 2005: Fourth International Symposium on Environmentally Conscious Design and Inverse Manufacturing, 12-14 December, Tokyo.
7. Giudice, F, L. R. Guido, and R. Antonino . 2006. Product design for the environment-A life cycle approach, Boca Raton, FL, USA: CRC.
8. Hewlett-Packard Development Company, L. P. 2010. MSDS: HP battery-Notebooks. Palo Alto, CA, USA: Hewlett-Packard Company. www.hp.com/hpinfo/globalcitizenship/environment/productdata/bamsdseng.html. Accessed July 2010.
9. Holt, R. and C. Barnes . 2010. Towards an integrated approach to "Design for X": An agenda for decision-based DFX research. Research in Engineering Design, 21(2): 123-136.
10. ISO (International Organization for Standardization). 2006. ISO 14040: Environmental management-Life cycle assessment-Principles and framework. Geneva: ISO.
11. ISO (International Organization for Standardization). 2011. ISO 14006: Environmental management-Guidelines for incorporating ecodesign. Geneva: ISO.
12. Karlsson R. and C. Luttropp . 2006. EcoDesign: What's happening? An overview of the subject area of EcoDesign and of the papers in this special issue. Journal of Cleaner Production 14(15-16): 1291-1298.
13. Kim B. C., D. Mun, and S. Han . 2010. Retrieval of CAD model data based on Web services for collaborative product development in a distributed environment. International Journal of Advanced Manufacture Technology 50(9-12): 1085-1099.
14. Klöpffer W. and O. Hutzinger . 1997. LCA documents: Life cycle assessment: State-of-the-art and research priorities. Bayreuth, Germany: Eco-Informa.
15. Middendrof, A., N. F. Nissen, H. Griese, J. Müller, H. Pötter, H. Reichl, and I. Stobbe . 2000. EE-Toolbox: A modular assessment system for the environmental optimization of electronics. Proceedings of the 2000 IEEE International Symposium on Electronics and the Environment, 8-10 May, San Francisco, CA, USA, 166-171.
16. Müller, J., H. Griese, N. F. Nissen, H. Pötter, and H. Reichl . 1999. Environmental aspects of PCB microintegration. Proceedings of EcoDesign'99: First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, 1-3 February, Tokyo, 216-220.
17. Nissen, N. F., H. Griese, A. Middendrof, J. Müller, H. Pötter, and H. Reichl . 1997. Environmental assessments of electronics: A new model to bridge the gap between full life cycle evaluations and product design. Proceedings of the 1997 IEEE International Symposium on Electronics and the Environment, 5-7 May, Piscataway, NJ, USA, 182-187.
18. Nissen, N. F., H. Griese, A. Middendrof, J. Müller, H. Pötter, and H. Reichl . 1998. An environmental comparison of packaging and interconnection technologies. Proceedings of the 1998 IEEE International Symposium on Electronics and the Environment, 4-6 May, Oak Brook, IL, USA, 106-111.
19. Nissen, N. F., H. Griese, A. Middendrof, J. Müller, H. Pötter, and H. Reichl . 1999. Environmental screening of packaging and interconnection technologies. Proceedings of EcoDesign'99: First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, 1-3 February, Tokyo, 754-759.
20. Pigosso, D. C. A., E. T. Zanette, A. G. Filho, A. R. Ometto, and H. Rozenfeld . 2010. Ecodesign methods focused on remanufacturing. Journal of Cleaner Production 18(1): 21-31.
21. Rounds K. S. and J. S. Cooper . 2002. Development of product design requirements using taxonomies of environmental issues. Research in Engineering Design 13(2): 94-108.
22. Ryan C. 2008. Climate change and ecodesign. Journal of Industrial Ecology 12(2): 140-143.
23. Ryan C. 2009. Climate change and ecodesign, part II: Exploring distributed systems. Journal of Industrial Ecology 13(3): 350-353.
24. Sakao, T. and Fargnoli, M. 2010. Customization in ecodesign: A demand-side approach bringing new opportunities? Journal of Industrial Ecology 14(4): 529-532.
25. Schischke, K., O. Deubzer, H. Griese, and I. Stobbe . 2002a. LCA for environmental management and eco-design in the electronics industry: State of the art and screening approaches. Paper presented at the internet-based InLCA/LCM conference, 20-25 May. www.lcacenter.org/lca-lcm/pdf/Electronics.pdf. Accessed May 2002.
26. Schischke, K., H. Griese, J. Müller, H. Reichl, and I. Stobbe . 2002b. Lean environmental management for green processes in electronics manufacturing-The screening assessment tool ProTox. Paper presented at the Electronic Circuits World Convention, 7-9 October, Cologne, Germany.
27. Socolof, M. L., J. G. Overly, and J. R. Geibig . 2005. Environmental life-cycle impacts of CRT and LCD desktop computer displays. Journal of Cleaner Production 13(13-14): 1281-1294.
28. Tukker A. and U. Tischner . 2006. New business for old Europe: Product-service development competitiveness and sustainability. Sheffield, UK: Greenleaf.
29. Van der Horst, T. J. J. and A. Zweers . 1994. Environmentally oriented product development-various approaches to success. Journal of Engineering Design 5(1): 37-44.
30. Vinodh, S., S. R. Devadasan, S. Maheshkumar, M. Aravindakshan, M. Arumugam, and K. Balakrishnan . 2010. Agile product development through CAD and rapid prototyping technologies: An examination in a traditional pump-manufacturing company. International Journal of Advanced Manufacture Technology 46(5-8): 663-679.
31. Wang, Q. H., J. R. Li, B. L. Wu, and X. M. Zhang . 2010. Live parametric design modifications in CAD-linked virtual environment. International Journal of Advanced Manufacture Technology 50(9): 859-869.
32. Yen, S.-B. and J. L. Chen . 2003. The development of Taiwan's toxic potential indicator (TPI). Proceedings of EcoDesign 2003: Third International Symposium on Environmentally Conscious Design and Inverse Manufacturing, 8-11 December, Tokyo, 632-635.
33. Yen, S.-B. and J. L. Chen . 2009. Calculation of a toxic potential indicator via Chinese-language material safety data sheets. Journal of Industrial Ecology 13(3): 455-466.