Microstructure evolution and enhanced tribological properties of cu-doped WS2 films

Tribology Letters

Volumn 55, Issue 1, 2014, Pages 1-13

  Xu, Shusheng ^a,b   Gao, Xiaoming ^a   Hu, Ming ^a   Wang, Desheng ^a   Jiang, Dong ^a   Sun, Jiayi ^a   Zhou, Feng ^a   Weng, Lijun ^a   Liu, Weimin ^a  

^a LANZHOU INSTITUTE OF CHEMICAL PHYSICS   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

Cu dopant; Mechanical tribological properties; Microstructure; WS2 film

Indexed keywords

COMPOSITE FILMS; FIELD EMISSION MICROSCOPES; FRACTURE MECHANICS; MICROSTRUCTURE; SEMICONDUCTOR DOPING; TRANSMISSION ELECTRON MICROSCOPY; TRIBOLOGY; X RAY DIFFRACTION; X RAY PHOTOELECTRON SPECTROSCOPY; X RAY SPECTROSCOPY;

FIELD EMISSION SCANNING ELECTRON MICROSCOPY; GRAZING INCIDENCE X-RAY DIFFRACTION; MECHANICAL AND TRIBOLOGICAL PROPERTIES; MECHANICAL PERFORMANCE; MECHANICAL/TRIBOLOGICAL PROPERTIES; MICRO-STRUCTURE EVOLUTIONS; TRANSITION STRUCTURES; TRIBOLOGICAL PROPERTIES;

COPPER;

EID: 84905673029     PISSN: 10238883     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11249-014-0322-3     Document Type: Article

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