Plasticity and ultra-low stress induced twin boundary migration in nanotwinned Cu by in situ nanoindentation studies

Applied Physics Letters

Volumn 104, Issue 23, 2014, Pages

  Liu, Y ^a   Jian, J ^b   Chen, Y ^a   Wang, H ^a,b   Zhang, X ^a  

^a Department of Electrical and Computer Engineering   (United States)

^b TEXAS A AND M UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MOLECULAR DYNAMICS; PLASTICITY; TRANSMISSION ELECTRON MICROSCOPY;

MICROSCOPIC LEVELS; MOLECULAR DYNAMICS SIMULATIONS; NANOINDENTATION TECHNIQUES; NANOTWINNED METALS; PLASTIC YIELDING; STRENGTH AND DUCTILITIES; TWIN BOUNDARIES; TWIN-BOUNDARY MIGRATIONS;

NANOINDENTATION;

EID: 84902440588     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4882242     Document Type: Article

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48. See supplementary material at http://dx.doi.org/10.1063/1.4882242 E-APPLAB-104-078423 for video 1: the in situ loading video under BF-TEM mode before dislocation nucleation, from which snapshots in Fig. 2 were captured. The ITB migration of fined twins (marked as T2 in Fig. 2) can be seen clearly at 13 and 17 s. Also, video 2: the in situ loading video focused on dislocation nucleation and penetration, as shown in Fig. 3. Dislocations nucleate at 31 s, propagate rapidly during 35-37 s. They penetrate a CTB (T3) at higher stress level, and large load drops occurred during 46-53 s.