Heat dissipation for microprocessor using multiwalled carbon nanotubes based liquid

The Scientific World Journal

Volumn 2013, Issue , 2013, Pages

  Thang, Bui Hung ^a   Trinh, Pham Van ^a   Chuc, Nguyen Van ^a   Khoi, Phan Hong ^a,b   Minh, Phan Ngoc ^a,b  

^a INSTITUTE OF MATERIALS SCIENCE   (Viet Nam)

^b GRADUATE UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Viet Nam)

Author keywords

[No Author keywords available]

Indexed keywords

MULTI WALLED NANOTUBE; WATER; CARBON NANOTUBE;

ARTICLE; COOLING; ENVIRONMENTAL TEMPERATURE; HEAT TOLERANCE; LIQUID; MICROCOMPUTER; MICROPROCESSOR; THERMAL CONDUCTIVITY; ULTRASOUND; VIBRATION; CHEMISTRY; HEAT;

HOT TEMPERATURE; MICROCOMPUTERS; NANOTUBES, CARBON;

EID: 84902162587     PISSN: None     EISSN: 1537744X     Source Type: Journal    
DOI: 10.1155/2013/305957     Document Type: Article

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