Simulation of thermal dissipation in a μ-processor using carbon nanotubes based composite

Computational Materials Science

Volumn 49, Issue 4 SUPPL., 2010, Pages

  Thang, Bui Hung ^a   Hong, Phan Ngoc ^a   Trinh, Pham Van ^a   Chuc, Nguyen Van ^a   Tam, Ngo Thi Thanh ^a   Khoi, Phan Hong ^a   Minh, Phan Ngoc ^a  

^a INSTITUTE OF MATERIALS SCIENCE   (Viet Nam)

Author keywords

CNTs based composite; MWCNTs; Thermal compound; Thermal dissipation; Processor

Indexed keywords

EFFICIENCY; ELECTRIC POWER SYSTEMS; HIGH POWER LASERS; MULTIWALLED CARBON NANOTUBES (MWCN); PERSONAL COMPUTERS; THERMAL MANAGEMENT (ELECTRONICS); THERMOANALYSIS; THERMOELECTRIC EQUIPMENT; WINDOWS OPERATING SYSTEM; YARN;

CARBON NANOTUBES-BASED COMPOSITES; CNTS BASED COMPOSITES; COMPUTER PROCESSORS; HIGH THERMAL CONDUCTIVITY; HIGH-POWER ELECTRONIC DEVICES; MWCNTS; THERMAL COMPOUNDS; THERMAL DISSIPATION;

THERMAL CONDUCTIVITY;

EID: 84859895201     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.commatsci.2010.01.027     Document Type: Conference Paper

References (19)

1. P.K. Schelling, L. Shi, K.E. Goodson, Materials Today 8 (6) (2005) 30-35.
2. Chia-Ken Leong, D.D.L. Chun, Carbon 41 (2003) 2459-2469.
3. T. Iwai, Y. Awano, Fujitsu Scientific and Technical Journal 43 (2007) 508-515.
4. Sebastine Ujereh, Timothy Fisher, Issam Mudawar, International Journal of Heat and Mass Transfer 50 (2007) 4023-4038.
5. Indra Vir Singh, Masataka Tanaka, Morinobu Endo, International Journal of Thermal Sciences 46 (2007) 842-847.
6. D.L. Ellis, D.L. McDaniels, Metallurgical Transactions A 24 (1993) 43-52.
7. Y. Feng, H. Yuan, Journal of Materials Science 39 (May) (2004) 3241-3243.
8. F. Wang, S. Arai, M. Endo, Electrochemistry Communications 6 (October) (2000) 1042-1044.
9. S. Shaikh, L. Li, K. Lafdi, J. Hui, Carbon 45 (2007) 2608-2613.
10. Da Jiang Yang et al., Physical Review B 66 (2002) 165440.
11. M.A. Panzer, Journal of Heat Transfer 130 (2008) 052401-1.
12. Handbook of Chemistry and Physics, 90th Edition, CRC, Internet Version 2010, section 12, pp.198-199.
13. S. Berver, Y.K. Kwon, D. Tománek, Physical Review Letters 84 (20) (2000) 4613-4616.
14. S. Shaikh et al., Carbon 45 (2007) 2608-2613.
15. http://processorfinder.intel.com/details.aspxcsSpec=SL8ZZ.
16. Bui Hung Thang, Cao Van Quang, Van Trong Nghia, Phan Ngoc Hong, Nguyen Van Chuc, Ngo Thi Thanh Tam, Le Dinh Quang, Dao Duc Khang, Phan Hong Khoi, Phan Ngoc Minh, Thermal dissipation efficiency in a micro-processor using carbon nanotubes based composite, in: International Workshop on Advanced Material for New and Renewable Energy, Jakarta, 9-11 June 2009, pp. 138-143.
17. Phan Ngoc Minh, Phan Hong Khoi, Carbon nanotube: a novel materials for applications, in: APCTP-ASEAN Workshop on Advanced Materials and Nanotechnology (AMSN2008), Nhatrang, Vietnam, 2008, pp. 27-36.
18. Bui Hung Thang, Phan Ngoc Hong, Phan Hong Khoi, Phan Ngoc Minh, Application of multi-walled carbon nanotubes for thermal dissipation in a micro-processor, in: APCTP-ASEAN Workshop on Advanced Materials Science and Nanotechnology (AMSN2008), Nha Trang, Vietnam, September 15-21, 2008, pp. 506-511.
19. Nguyen Van Chuc, Nguyen Duc Dung, Phan Ngoc Hong, Le Dinh Quang, Phan Hong Khoi, Phan Ngoc Minh, Journal of the Korean Physical Society 52 (5) (2008) 1368-1413.