Thermal dissipation media for high power electronic devices using a carbon nanotube-based composite

Advances in Natural Sciences: Nanoscience and Nanotechnology

Volumn 2, Issue 2, 2011, Pages

  Bui, Hung Thang ^a   Nguyen, Van Chuc ^a   Pham, Van Trinh ^a   Ngo, Thi Thanh Tam ^a   Phan, Ngoc Minh ^a  

^a GRADUATE UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Viet Nam)

Author keywords

Multi walled carbon nanotubes; Thermal dissipation; Thermal paste; processor

Indexed keywords

LIGHT EMITTING DIODES; NANOTUBES; POWER ELECTRONICS; THERMAL CONDUCTIVITY; THERMOANALYSIS; THERMOELECTRIC EQUIPMENT;

ELECTRONIC PACKAGE; HIGH-POWER ELECTRONIC DEVICES; NANOTUBE-BASED COMPOSITES; POWER DENSITIES; THERMAL DISPERSION; THERMAL DISSIPATION; THERMAL PASTE; VERTICALLY ALIGNED CARBON NANOTUBE;

MULTIWALLED CARBON NANOTUBES (MWCN);

EID: 84894176845     PISSN: None     EISSN: 20436262     Source Type: Journal    
DOI: 10.1088/2043-6262/2/2/025002     Document Type: Article

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