Determination of thermoelectric module efficiency: A survey

Journal of Electronic Materials

Volumn 43, Issue 6, 2014, Pages 2274-2286

  Wang, Hsin ^a   McCarty, Robin ^b   Salvador, James R ^c   Yamamoto, Atsushi ^d   König, Jan ^e  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

^b Marlow Industries   (United States)

^c GENERAL MOTORS CORPORATION   (United States)

^d NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^e FRAUNHOFER INSTITUTE FOR PHYSICAL MEASUREMENT TECHNIQUES IPM   (Germany)

Author keywords

efficiency; figure of merit; module; Thermoelectric

Indexed keywords

EFFICIENCY; HEAT RESISTANCE; SURVEYS; TESTING; THERMOELECTRICITY;

DEVICE DEVELOPMENT; FIGURE OF MERITS; HEAT FLOW METER METHOD; INDUSTRY STANDARDS; INTERNATIONAL STANDARDIZATION; MODULE; THERMO-ELECTRIC MODULES; THERMOELECTRIC;

THERMOELECTRIC ENERGY CONVERSION;

EID: 84901944170     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-014-3044-2     Document Type: Article

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