A biocompatible low temperature co-fired ceramic substrate for biosensors

International Journal of Applied Ceramic Technology

Volumn 11, Issue 3, 2014, Pages 436-442

  Luo, Jin ^a   Eitel, Richard E ^a  

^a UNIVERSITY OF KENTUCKY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; BIOCOMPATIBILITY; CERAMIC MATERIALS; DIELECTRIC LOSSES; ENDOTHELIAL CELLS; FAILURE (MECHANICAL); MEDICAL APPLICATIONS; MICROELECTRONICS; MILITARY APPLICATIONS; SILICATES; SINTERING;

BIOMEDICAL APPLICATIONS; HUMAN UMBILICAL VEIN ENDOTHELIAL CELLS; LOW DIELECTRIC CONSTANTS; LOW-TEMPERATURE CO-FIRED CERAMICS; MICROELECTRONIC COMPONENTS; MOBILE ELECTRONICS; SINTERING TEMPERATURES; TYPICAL APPLICATION;

BIOLOGICAL MATERIALS;

EID: 84899951519     PISSN: 1546542X     EISSN: 17447402     Source Type: Journal    
DOI: 10.1111/ijac.12206     Document Type: Article

References (25)

1. G. M. Whitesides, Nature, 442 368-373 (2006).
2. P. Yager, et al,., Nature, 442 412-418 (2006).
3. M. R. Gongora-Rubio, P. Espinoza-Vallejos, L. Sola-Laguna, and, J. J. Santiago-Aviles, Sens. Actuators A. Phys., 89 222-241 (2001).
4. D. J. Sadler, R. Changrani, P. Roberts, C. F. Chou, and, F. Zenhausern, IEEE Trans. Compon. Packag. Technol., 26 309-316 (2003).
5. P. Bembnowicz, et al,., Opt. Appl., 41 471-480 (2011).
6. N. Ibanez-Garcia, R. D. M. Goncalves, Z. M. da Rocha, M. R. Gongora-Rubio, A. C. Seabra, and, J. A. Chamarro, Sens. Actuators B. Chem., 118 67-72 (2006).
7. M. R. Gongora-Rubio, M. B. A. Fontes, Z. M. da Rocha, E. M. Richter, and, L. Angnes, Sens. Actuators B. Chem., 103 468-473 (2004).
8. W. Smetana, B. Balluch, G. Stangl, E. Gaubitzer, M. Edetsberger, and, G. Kohler, Microelectron. Eng., 84 1240-1243 (2007).
9. W. L. Zhang, and, R. E. Eitel, Int. J. Appl. Ceram. Technol., 9 60-66 (2012).
10. G. Sjogren, G. Sletten, and, J. E. Dahl, J. Prosthet. Dent., 84 229-236 (2000).
11. C. R. Chang, and, J. H. Jean, J. Am. Ceram. Soc., 82 1725-1732 (1999).
12. C. L. Lo, J. G. Duh, B. S. Chiou, and, W. H. Lee, J. Am. Ceram. Soc., 85 2230-2235 (2002).
13. S. X. H. Dai, R. F. Huang, and, D. L. Wilcox, J. Am. Ceram. Soc., 85 828-832 (2002).
14. H. Jantunen, R. Rautioaho, A. Uusimaki, and, S. Leppavuori, J. Eur. Ceram. Soc., 20 2331-2336 (2000).
15. K. G. Ewsuk, Ceram. Trans. Mater. Processes Microelectron. Syst., 15 279-295 (1989).
16. K. G. Ewsuk, L. W. Harrision, and, F. J. Walczak, Ceram. Trans. Ceram. Powder Sci. II, 1 967-975 (1987).
17. S. Kemethmuller, M. Hagymasi, A. Stiegelschmitt, and, A. Roosen, J. Am. Ceram. Soc., 90 64-70 (2007).
18. S. Rajesh, H. Jantunen, M. Letz, and, S. Pichler-Willhelm, Int. J. Appl. Ceram. Technol., 9 52-59 (2012).
19. C. J. D. Kumar, E. K. Sunny, N. Raghu, N. Venkataramani, and, A. R. Kulkarni, J. Am. Ceram. Soc., 91 652-655 (2008).
20. M. T. Sebastian, and, H. Jantunen, Int. Mater. Rev., 53 57-90 (2008).
21. P. Ciosek, et al,., Anal. Bioanal. Chem., 393 2029-2038 (2009).
22. H. B. de Torres, C. Rensch, M. Fischer, A. Schober, M. Hoffmann, and, J. Muller, Sens. Actuators A. Phys., 160 109-115 (2010).
23. A. H. Feingold, M. Heinz, and, R. L. Wahlers, Proc. IMAPS Denver, 4931 65-70 (2002).
24. W. K. Jones, Y. Liu, B. Larsen, P. Wang, and, M. Zampino, Int. J. Microcircuits Electron. Packaging, 23 5 (2000).
25. J. X. Liu, D. Z. Yang, F. Shi, and, Y. J. Cai, Thin Solid Films, 429 225-230 (2003).