Compliant dielectric and magnetic materials for buried components

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4931, Issue , 2002, Pages 65-70

  Feingold, A H ^a   Heinz, M ^a   Wahlers, R L ^a  

^a Electro Science Lab Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; CERAMIC MATERIALS; DIELECTRIC MATERIALS; ELECTRIC CONDUCTIVITY; ELECTRIC CONDUCTORS; FERRITES; INDUCTANCE; INSERTION LOSSES; MAGNETIC TAPE; PERMITTIVITY;

BURIED FERRITE TAPE; LOW TEMPERATURE COFIRED CERAMIC TAPES;

MICROELECTRONIC PROCESSING;

EID: 0036450341     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Advanced Packaging, March, 2000
2. S.-Y. Tzeng and J-H Jean; Stress Development During Constrained Sintering of Alumina/Glass/Alumina Sandwich Structure, Journal American Ceramic Society; vol. 88, No. 2, pp 335-340, 2002
3. A.H. Feingold, R. L. Wahlers, and S.J. Stein; Lead Free Dielectric Tape System for High Frequency Applications; Proceedings of IMAPS Baltimore, October 2001
4. A.H. Feingold, C. Huang, and S.J. Stein,; Low K, Low Loss, Low Fire Tape System for Microwave Applications; Proceedings of IMAPSEurope Prague June 2000; pp. 163-168