Thermal and dielectric behavior of epoxy composites filled with ceramic micro particulates

Journal of Composite Materials

Volumn 48, Issue 30, 2014, Pages 3755-3769

  Agrawal, Alok ^a   Satapathy, Alok ^a  

^a NATIONAL INSTITUTE OF TECHNOLOGY   (India)

Author keywords

aluminium nitride; aluminium oxide; coefficient of thermal expansion; dielectric constant; effective thermal conductivity; epoxy; glass transition temperature; Polymer composites

Indexed keywords

ALUMINA; ALUMINUM NITRIDE; ALUMINUM OXIDE; ELECTRONICS PACKAGING; EPOXY RESINS; FILLED POLYMERS; FILLERS; GLASS; GLASS TRANSITION; III-V SEMICONDUCTORS; NITRIDES; PARTICLES (PARTICULATE MATTER); PERMITTIVITY; PRINTED CIRCUIT BOARDS; TEMPERATURE; THERMAL EXPANSION;

ALUMINIUM OXIDE; EFFECTIVE THERMAL CONDUCTIVITY; EPOXY; EQUIVALENT THERMAL CONDUCTIVITIES; MATHEMATICAL CORRELATION; PARTICULATE FILLED POLYMERS; POLYMER COMPOSITE; THERMAL MECHANICAL ANALYZERS;

THERMAL CONDUCTIVITY;

EID: 84899644972     PISSN: 00219983     EISSN: 1530793X     Source Type: Journal    
DOI: 10.1177/0021998313513205     Document Type: Article

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