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Materials Chemistry and Physics

Volumn 146, Issue 1-2, 2014, Pages 82-87

Preparation of conductive Cu patterns by directly writing using nano-Cu ink

(5) Li, Wei a Li, Wenjiang b Wei, Jun b Tan, Junjun c Chen, Minfang b

a TIANJIN UNIVERSITY (China)

b TIANJIN UNIVERSITY OF TECHNOLOGY (China)

c HUBEI UNIVERSITY OF TECHNOLOGY (China)

Author keywords

Electrical conductivity; Microstructure; Oxidation; Sintering

Indexed keywords

MICROSTRUCTURE; OXIDATION; RADIO FREQUENCY IDENTIFICATION (RFID); SCANNING ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY; X RAY POWDER DIFFRACTION; X RAYS;

ELECTRICAL CONDUCTIVITY; ENERGY DISPERSIVE X-RAY SPECTROMETRY; HIGH CONDUCTIVITY; LOW SINTERING TEMPERATURE; METALLIC CU NANOPARTICLES; PHOTO PAPERS; POLY-N-VINYLPYRROLIDONE; X RAY PHOTOELECTRON SPECTRA;

SINTERING;

EID: 84899419150 PISSN: 02540584 EISSN: None Source Type: Journal
DOI: 10.1016/j.matchemphys.2014.02.045 Document Type: Article

Times cited : (37)

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