Electrical performance and reliability evaluation of inkjet-printed Ag interconnections on paper substrates

Materials Letters

Volumn 88, Issue , 2012, Pages 68-72

  Xie, Li ^a   Mäntysalo, Matti ^b   Cabezas, Ana López ^a   Feng, Yi ^a   Jonsson, Fredrik ^a   Zheng, Li Rong ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

85 C 85 RH; Electrical resistivity; Inkjet printing; Nanoparticle silver ink; Paper substrate; Reliability

Indexed keywords

AGING TESTS; ELECTRICAL PERFORMANCE; ELECTRICAL RESISTIVITY; ENVIRONMENTAL VARIATIONS; INK JET PAPER; MASS MANUFACTURING; MOISTURE RESISTANCE; NANO-PARTICLE SILVER; PAPER SUBSTRATE; PHOTO PAPERS; PRINTED ELECTRONICS; PRINTING TECHNOLOGIES; RELIABILITY EVALUATION; VARIOUS SUBSTRATES;

COSTS; ELECTRIC CONDUCTIVITY; INK JET PRINTING; MOISTURE; PAPER; RELIABILITY; SILVER; TESTING;

SUBSTRATES;

COSTS; INK; INK JET PRINTING; MOISTURE; PAPER; RELIABILITY; RESISTIVITY; SILVER; SUBSTRATES;

EID: 84866605755     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2012.08.030     Document Type: Article

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